mPower power integrity analysis solution certified by Tower Semiconductor for advanced analog process technologies

The Siemens mPower power integrity solution, the first and only IC power integrity analysis solution that provides virtually unlimited scalability…

TSMC OIP Forum celebrates collaboration and innovation…and we have the awards to prove it!

TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners with the common goal of shortening…

Samsung Foundry and Siemens EDA: Helping companies design the next generation of Performance Platforms 2.0

Since 2018, the Samsung Advanced Foundry Ecosystem (SAFE™) program has encouraged and supported deep collaboration between Samsung Foundry and its…

Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

TSMC customers and partners always look forward to the annual TSMC Open Innovation Platform® (OIP) Forums. Here, they get the…

Fix first, finish faster!

By James Paris A few years ago, I came across some plans to build a simple bookshelf that would fit…

In the EDA world, efficiency + ease of use = productivity (and profitability!)

By Shelly Stalnaker Electronic design automation (EDA) grew out of the need to make it easier and faster to design…

Cloud Computing Makes Overnight TAT Attainable

By Matthew Hogan and Derong Yan As we all know, during the final sign-off verifications of full chip system-on-chip (SoC)…

Companies talk about how mPower enables their tape-out success

By Joe Davis Earlier this week, we introduced our new mPower product line for power integrity signoff analysis.  Our innovative…

We know…power integrity analysis can be a really big pain, especially for really big designs

By Joe Davis Design teams use power integrity analysis to determine if the circuits in their designs will provide the…