Siemens and HP win 2020 Edison Award for 3D Printing Enhancements

By Pete Tiernan

The Edison Awards organization announced that HP and Siemens had won a silver award in the category of “Materials Science & Engineering” for their strategic alliance to help manufacturers industrialize additive manufacturing.

On their website announcing the 2020 winners (, Edison Awards wrote, “The digital transformation of our society and economy is accelerating, but how can customers reinvent their businesses with additive manufacturing? Enter HP and Siemens, whose new strategic alliance will enable manufacturers to bring 3D printed parts to market faster, more cost-effectively, more sustainably, and at higher volumes than ever before.”

Originally established in 1987, the Edison Awards™ have recognized and honored some of the most innovative products and business leaders in the world. The award is among the most prestigious accolades honoring excellence in new product and service development, marketing, design and innovation.

In bestowing the award, Edison Awards singled out the recent expansion of the Siemens/HP strategic alliance, which featured the integration of HP’s new Jet Fusion 5200 Series 3D printing solution with Siemens’ Digital Industries Software offerings. The two companies announced their expanded alliance in May at an event celebrating the addition of a new Polymer Competency Center to the Siemens Additive Manufacturing Experience Center (AMEC) in Erlangen, Germany.

HP and Siemens recently worked together to showcase the power of their solution for designing functionally optimized products and producing 3D printed parts at industrial scale. To learn more about their work together using flow-based optimization to improve a 3D printer’s cooling system, go to:

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This article first appeared on the Siemens Digital Industries Software blog at