This year the Rapid + TCT conference is a hybrid event and Siemens is participating in both aspects of the event. Siemens doesn’t have the traditional physical booth on the tradeshow floor. However we do have a virtual booth that is accessible to any attendees across the world at any time during the event. We are also sponsoring the VIP lounge at the physical Rapid conference, so if you have a VIP ticket you will find Siemens representatives in the VIP lounge and walking around the conference.
If you would like to talk with a Siemens Software expert about additive manufacturing, please contact Chris Weber at email@example.com.
We hope to see you at Rapid, and we look forward to talking with you about the future of additive manufacturing either at the physical conference or through our virtual booth.