Investing in Future Aerospace Innovators at EAA AirVenture

EAA Oshkosh – July 26–August 1

Oshkosh, WI

With summer upon us, our Siemens Digital Industries Software Academic Enablement Team is stepping up and stepping out to invest in future aerospace innovators at EAA’s AirVenture 2021 week in Oshkosh, WI.

The Academic Partner Program at Siemens focuses on workforce development and is always excited to enable learners of all ages to explore a multitude of facets in aerospace from designing, and engineering to producing next generation flying machines.  With a focus on experimental aircrafts, EAA AirVenture is the perfect place to begin empowering the next generation of digital talent.  The earlier people get hands-on with engineering, the more likely they are to build a future as engineers and leaders in this transformative industry of aerospace.

Siemens’ array of real-world tools, technical expertise, and strong industry collaboration with education will come to life at EAA AirVenture and KidVenture this year.  From showcasing vintage aircraft restoration, participating in demonstrations, to hearing from young engineers and client companies, there will be plenty to experience at the Siemens booth.

Adding to the excitement of participating at AirVenture is an announcement that will be made at the airshow. Check your local media feed on July 26th to learn more or start following #OSH21 to hear the announcement.

Shannon O’Donnell, Americas Zone Strategy Lead at Siemens DI SW Academic Programs

Global Academic Partner Program Home
Student-Exclusive LinkedIn Group – Network with industry professionals, educators and peers
Curriculum Hub  – Free classroom downloads (great for virtual classrooms, too!)
Academic Certifications and Digital Badges – Get certified in NX, Solid Edge, Simcenter Amesim, MBSE and more
Software Downloads – Free software for students and educators!

Want to stay up to date on news from Siemens Digital Industries Software? Click here to choose content that's right for you

Leave a Reply

This article first appeared on the Siemens Digital Industries Software blog at