How to Optimize PCB Design for the SMT Assembly Process Flow
PCB (Printed Circuit Board) design layout optimization is critical for the success of SMT (Surface Mount Technology) assembly. SMT assembly involves placing surface mount components directly onto the surface of the PCB, as opposed to through-hole components, which require holes to be drilled through the PCB. SMT assembly is faster, more precise, and more cost-effective than through-hole assembly, but it requires careful design optimization to ensure a successful assembly process.
Proactive Design for Test (DFT) best practices
The process of PCB DFT needs to be considered sooner and more proactively in our PCB design process, incorporated in the schematic phase, not during the layout phase. A designer should determine what nets will be needed to be tested based on their likelihood of failure and position those pins in open, accessible real-estate.
What is Design for Manufacturing?
PCB DFM looks at all factors that may impact the manufacturability of a PCB design, such as assembly, fabrication, flex/rigid-flex, microvia, panel and substrate. It should also consider whether SMT component placement and soldering can be conducted automatically to reduce costs. DFM can involve general manufacturing specifications and/or the specifications of a specific manufacturer.