Solder strength testing and validation

Strengthening PCB Solder Connections

To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.

Exploring Manufacturing Driven Design for automated DFM

Manufacturing Driven Design leverages the intelligence within your PCB Design

Intelligent Process-Driven DFM Analysis for PCB Designers Recent component shortages and distribution disruptions have exposed both the fragility of global…

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Manufacturing Driven Design – Taking DFM to the Next Level

Manufacturing Driven Design (MDD) is an evolutionary approach to DFM. It enables the effortless exchange of manufacturing process constraints so that an OEM can assess the manufacturability of a design in perfect alignment with their supplier

Making Parts Part of Manufacturing Driven Design

When it comes to PCB assembly level MDD, many designers have not concerned themselves with the component manufacturing Bill of Material (BOM). Designers work from a CAD library that has component libraries associated with internal part numbers (IPN) their company uses. The CAD Design Rule Checking software uses those CAD library shapes for its analysis and even, in some cases, the avoidance of where components are placed. There is nothing wrong conceptually with this mentality. However, like all things, the details matter.