The good, bad, and brilliance of ultra high-density interconnect (UHDi)
What is Ultra High Density Interconnect (UHDi) technology, and why is it critical for modern PCB designs? How does collaboration between designers and fabricators ensure the success of UHDi boards?
In this episode of The Printed Circuit Podcast, host Steph Chavez from Siemens talks with Anaya Vardya, CEO of American Standard Circuits, about Ultra High Density Interconnect (UHDi) technology and its growing importance in industries like telecommunications, aerospace, and medical devices.
Anaya explains how UHDi enables smaller, higher-performance PCBs through advanced techniques like microvias and optimized layouts. He also discusses the key challenges in manufacturing these complex boards, such as sequential builds and specialized equipment.
Listeners will learn about the importance of early collaboration between designers and fabricators to avoid costly mistakes and delays. Anaya and Steph also touch on the future of PCB technology and the increasing need for advanced solutions like UHDi.
What you’ll learn in this episode:
- What is UHDi technology? (3:15)
- Feedback from the SMTA International Electronics Manufacturing Conference (5:00)
- What are the design advantages of using UHDi? (6:35)
- What are the disadvantages of using UHDi? (9:35)
- What are some typical applications where UHDi would be implemented? (12:25)
- What are the manufacturing challenges of UHDi technology? (14:15)
- Where can designers or engineers learn more about UHDi technology? (19:20)
