Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Partner of the month: MCP Algorithm Factory – Elevating production planning with Opcenter APS

February 09, 2026

This edition of the APS “Partner of the Month” series highlights MCP Algorithm Factory. From its beginnings as an industrial...

Energy & Utilities

Advancing molecular-level engineering: Chevron's use of Simcenter Culgi for enhanced asphaltene understanding

February 06, 2026

Learn how Simcenter Culgi empowered Chevron’s engineers with multiscale computational chemistry simulations enabling unparalleled molecular-level insights.

By Justin Tuttle

Thought Leadership

AI accelerates efficient chip design

February 06, 2026

AI is finding a place in all sorts of new products and industries but as adoption continues to accelerate, key...

By Spencer Acain

Thought Leadership

Unlocking circularity with a digital-first approach

February 06, 2026

A lot can be done to make current economic models more sustainable. Much of today’s economy operates under a take-make-waste...

By Quinn Foster

Siemens Software Podcast Network

AI-powered simulation: a new era for industrial engineering- episode 8 of IM and AI podcast

February 06, 2026

Chris, Rahul and Dirk discuss democratizing simulation through AI and the real-world gains businesses have seen from the digital twin.

Accelerate EV geartrain NVH simulation: 5x faster with Simcenter 3D Motion

February 06, 2026

Why NVH performance matters The electric vehicle (EV) revolution is here, promising a cleaner, more efficient future for transportation. But...

By Jonas Verhoogen, Willem Versteden

Consumer Products & Retail

Why flexible manufacturing is the new competitive battleground in CPG

February 05, 2026

A major beverage producer runs flagship products at 50,000 bottles per hour. Two hours later, the same line switches to...

By Sanjay Narasimha

Semiconductor Packaging

Five Key Trends of Co-Packaged Optics (CPO) in 2026

February 05, 2026

For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs....

By Tony Mastroianni

Semiconductor Packaging

Six Key Trends Redefining 3D IC Packaging in the AI Era

February 05, 2026

Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day...

By Pratyush Kamal

Latest podcast episodes

The Industry Forward Podcast

A devastating surprise industries see with AI integration

Industrial AI integration cannot ignore operational technology (OT) and information technology (IT).

By Shawn Wasserman

From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands

“The first call would be for all our EDA partners to shift from a tool-centric thinking to a system level...

Printed Circuit Podcast

Proactive BOM analysis: Turning supply chain risk into competitive advantage

What if the part you approved in five minutes ends up costing your company ten million dollars down the line?...