Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

Simcenter

Vibrated with confidence: a recap of Siemens' recent aircraft ground vibration testing masterclass

Missed out on the ground vibration testing (GVT) Europe Masterclass 2023? Read this blog to see the recap of this edition!

Siemens Xcelerator Academy

Empower your career journey: The Gift of Certification  

This is the season of giving, and this Christmas, Siemens Xcelerator Academy is unwrapping a special gift just for you:...

Polarion

18. December: A gift from Santa’s little helpers: the Livepage Reuser

Of course, Santa uses many LiveReports, e.g. to check if we all have been good or bad. And of course...

Teamcenter

🟡 Microsoft Ignite spotlight: Teamcenter + Teams + OpenAI

Siemens and Microsoft are coming together to help you collaborate and design better products faster with the help of generative AI.

Polarion

17. December: Opening Historic Versions of Projects – The Easy Way

As every year, Santa is already very busy during the first days of December in preparation for Christmas.Because of that,...

Polarion

16. December: Seabay helps packing Santa's bag

In the North Pole workshop, Santa Claus is meticulously preparing for Christmas Eve, examining wish lists filled with diverse gifts....

Polarion

2024 Realize Live

Apply now to share your Polarion story 🌐 Get your early bird pass now Realize LIVE 2024 is an inclusive...

Aerospace & Defense

Trending aerospace webinars in 2023

It’s been a busy year in the aerospace and defense industries, and we imagine you’ve been busy as well. As...