Siemens Digital Industries Software Blogs

Discover how Siemens EDA’s novel Keyphrase Trees technique uses hierarchical clustering and advanced AI to transform keyphrase extraction for electronic design automation. Learn how this method improves accuracy, unlocks domain independence, and streamlines information management for chip design teams.

Blog post and interview from Guillermo Nieves, summer 2025 intern.

Blog post an interview from Paul Daumeyer, summer 2025 intern.

In a world increasingly dominated by connected machines and technology, cybersecurity is key area that can’t be ignored yet, managing...

In the third episode of industrial machinery and AI series in our Digital Transformation podcast, host Chris Pennington, global industry...

The types of aircraft and spacecraft being flown are always changing, and in the last few years especially, the world...

Download “Advanced design for heavy equipment: accelerating engineering transformation“ Challenges in heavy equipment manufacturing We’re excited to announce the release...

The semiconductor industry is steadily moving toward multi-die integration, where chiplets from different sources are combined within a single package (known as a system in package or SiP) to deliver higher performance, scalability, and efficiency. The Universal Chiplet Interconnect Express (UCIe) standard is the backbone of this movement, offering a high-bandwidth, low-latency interconnect that enables heterogeneous chiplets to operate as one system. UCIe 3.0 raises the bar once again. By adding higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, the standard improves both performance and efficiency. But it also increases verification complexity.

The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,...