Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Energy & Utilities

Accelerate your bid and tender process efficiency by 25% using AI

Learn how our new AI tool dramatically improves bid and tender process efficiency, bid document accuracy and collaboration.

NX Design

Executive Insights with Bob Haubrock | Designcenter

Bob Haubrock, Senior Vice President at Siemens Digital Industries Software, is a name synonymous with innovation in the CAD world....

Siemens Software Podcast Network

Speaking the language of software and electronics in automotive - Ep. 7

We’re back for episode seven of On the Move: A Siemens Automotive podcast. This is part two of Nand Kochhar...

Thought Leadership

Communicating across software, electronics, and hardware in SDVs

The software-defined vehicle (SDV) is not only pushing OEMs to adopt more of the electronics and software development in-house, but...

Digital Logistics

Customer voices live: Flex and Baker Hughes reveal practical supply chain solutions at Gartner 2025 

Don’t Miss Our Exclusive Speaking Session at Gartner Supply Chain Symposium/Xpo™ 2025 in Orlando, FL: “Siemens: How Flex and Baker...

Opcenter

What’s new in Opcenter Intra Plant Logistics 2504

Enhanced transport management and execution control for scalable intralogistics Efficient intralogistics operations are essential for maintaining smooth material flow within...

Capital

Don't miss Siemens Capital at EWPTE, the Electrical Wire Processing Technology Expo

Visit Siemens Capital at EWPTE, presented by “the ONLY trade association exclusively representing the cable and wire harness manufacturing industry...

Design with Calibre

Smart strategies for metal fill extraction

By Shehab Ashraf As semiconductor technology continues to scale, the impact of parasitic effects from metal fill structures has become...

Electronic Systems Design

PCB high voltage spacing: What every engineer should know

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.