Digital twins: The key to mastering cross-domain engineering challenges

Digital twins: The key to mastering cross-domain engineering challenges

October 9, 2024

Your team just discovered a major flaw in your latest smart product: the electronics don’t fit the mechanical housing, and…

By Gabriella Leone
3 MIN READ

Engineer’s Corner: Coordinating design across engineering disciplines

September 6, 2024

The growing need for cross-domain collaboration Are your engineering teams speaking the same language? In an era of increasingly complex…

By Gabriella Leone
3 MIN READ

Digital transformation: Solving age-old challenges in electronics manufacturing

September 5, 2024

In the fast-paced electronics and semiconductor manufacturing world, one challenge has persisted for decades: the inefficient management of engineering change…

By Gabriella Leone
3 MIN READ

Engineer’s Corner: Real-world BOM challenges

August 22, 2024

Navigating product variability in consumer electronics In today’s fast-paced electronics industry, managing Bills of Materials (BOMs) for products with multiple…

By Gabriella Leone
2 MIN READ

Bridging the gaps in electronic systems design Blog series | Closing the loop: Extending the digital thread to manufacturing – Part 4

July 2, 2024

Time is the one resource that electronics companies can never have enough of. In an industry where product lifecycles are…

By Gabriella Leone
4 MIN READ

Bridging the gaps in electronic systems design Blog series | The key to unlocking innovation – Part 3

June 24, 2024

Did you know that companies using simulation to explore design ideas report 74% better products and 50% faster innovation? In…

By Gabriella Leone
3 MIN READ
The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

June 20, 2024

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

By Michael Munsey and Gabriella Leone
3 MIN READ
An engineer is working at a computer workstation with multiple monitors displaying electronic system designs and schematics. The title above the image reads "Electronic systems design: Blog series - Part 2 Accelerating mechanical and electrical design".

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

June 12, 2024

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

By Gabriella Leone
3 MIN READ
A man in a fshipping factory looking over the work on a tablet. The image reads the blogs title name.

Bridging the gaps in electronic systems design Blog series | The power of an integrated platform – Part 1

June 7, 2024

In today’s rapidly evolving electronics industry, companies face unprecedented challenges in developing complex, innovative products within tight schedules and budgets….

By Gabriella Leone
3 MIN READ