Escaping the Oracle Agile trap: Why Teamcenter is your only path to digital transformation

Escaping the Oracle Agile trap: Why Teamcenter is your only path to digital transformation

Are you trapped in the Oracle Agile dilemma? If you’re managing product development with Oracle Agile, you’re facing a critical...
Collaborative semiconductor business platform: the future of industry partnerships | Executive strategy deep-dive- Part 3

Collaborative semiconductor business platform: the future of industry partnerships | Executive strategy deep-dive- Part 3

In this third installment of our interview series, we dive into Pillar 2 of Michael Munsey’s three-pillar strategy for semiconductor...
Collaborative semiconductor business platform: the future of industry partnerships | Executive strategy deep-dive- Part 2

Collaborative semiconductor business platform: the future of industry partnerships | Executive strategy deep-dive- Part 2

In this second installment of our interview series, we continue exploring Siemens’ three-pillar strategy for semiconductor industry transformation. Host Gabriella...
Harnessing simulation technology for circuit breaker innovation

Harnessing simulation technology for circuit breaker innovation

Our simulation technology is revolutionizing circuit breaker design by enhancing efficiency, safety, and performance while reducing costs and time to...
Engineering deep dive: Technical insights from our multiphysics design optimization webinar

Engineering deep dive: Technical insights from our multiphysics design optimization webinar

Exploring the power of multiphysics design optimization Electric vehicle power modules are getting smaller, hotter, and more complex. But what...
Seeing through the complexity: real-time visibility in semiconductor lifecycle management 

Seeing through the complexity: real-time visibility in semiconductor lifecycle management 

In a time of intense change across the semiconductor ecosystem, one critical question emerges: Is your company equipped with end-to-end...
The $50 million component crisis that changed everything while reducing risks

The $50 million component crisis that changed everything while reducing risks

Sarah Chen thought she had everything under control. As VP of Supply Chain at a major consumer electronics manufacturer, she’d...
Executive brief: From 5 days to 1.5 days: how quality leaders are crushing development cycles

Executive brief: From 5 days to 1.5 days: how quality leaders are crushing development cycles

Bottom line up front: Only 25% of companies consistently apply quality metrics in their projects, creating a massive competitive opportunity...
Blog series: Smart factory insights: Opcenter IPL in action, Part 5  

Blog series: Smart factory insights: Opcenter IPL in action, Part 5  

Part 5: Three critical moments reshaping material flow in electronics manufacturing  Throughout our series, we’ve examined how Opcenter IPL transforms...
Blog series: Smart factory insights: Opcenter IPL in action, Part 4

Blog series: Smart factory insights: Opcenter IPL in action, Part 4

Part 4: The ROI of seamless workflow in electronics manufacturing In our series so far, we’ve explored how Opcenter IPL...
Blog series: Smart factory insights: Opcenter IPL in Action, Part 3

Blog series: Smart factory insights: Opcenter IPL in Action, Part 3

Part 3: Mastering intralogistics challenges in electronics manufacturing In our previous posts, we explored how Opcenter IPL revolutionizes manufacturing operations...
Blog Series: Smart factory insights: Opcenter IPL in action, Part 2

Blog Series: Smart factory insights: Opcenter IPL in action, Part 2

Part 2: Optimizing efficiency with reduced side inventory In our previous post, we introduced Opcenter Intra Plant Logistics (IPL). Now,...
Blog Series: Smart Factory Insights: Opcenter IPL in Action, Part 1

Blog Series: Smart Factory Insights: Opcenter IPL in Action, Part 1

Part 1: Revolutionizing Intra Plant Logistics  Welcome to our new series, “Smart Factory Insights: Opcenter IPL in Action.” In this...
The 80% rule: Why electronics cost control starts in design, not procurement

The 80% rule: Why electronics cost control starts in design, not procurement

Electronics engineers face a brutal reality: up to 80% of product cost is set during the design phase, yet most...
Start compliant and stay compliant: the electronics engineer’s guide to risk-free product development

Start compliant and stay compliant: the electronics engineer’s guide to risk-free product development

You know the nightmare scenario: Six months into production, a regulatory audit uncovers a compliance gap that should have been...
From prototype to production: Building bulletproof validation workflows for complex electronics systems

From prototype to production: Building bulletproof validation workflows for complex electronics systems

The sobering reality facing electronics manufacturers today is that 70% of field failures stem from thermal issues that could have...
The 50% problem: why electronics teams waste half their innovation time searching for data

The 50% problem: why electronics teams waste half their innovation time searching for data

Your best engineers aren’t designing breakthrough products. They’re hunting for files. According to IDC research, data professionals are losing 50%...
Collaboration: The key to semiconductor industry growth and resilience | Executive strategy deep-dive- Part 1

Collaboration: The key to semiconductor industry growth and resilience | Executive strategy deep-dive- Part 1

In this two-part Q&A interview series, we sit down with Michael Munsey, Vice President of Semiconductors and Electronics at Siemens Digital Industries Software. Michael shares his insights on Siemens' forward-thinking three-pillar strategy, designed to position the company as a key enabler of semiconductor industry growth through greater collaboration, software-driven innovation, and digital transformation.
How electronics manufacturers are rethinking quality in the AI era

How electronics manufacturers are rethinking quality in the AI era

The electronics manufacturing landscape has fundamentally changed. With product complexity soaring and development cycles shrinking, traditional approaches to quality management...
Digital twins: The key to mastering cross-domain engineering challenges

Digital twins: The key to mastering cross-domain engineering challenges

Your team just discovered a major flaw in your latest smart product: the electronics don’t fit the mechanical housing, and...
Engineer’s Corner: Coordinating design across engineering disciplines

Engineer’s Corner: Coordinating design across engineering disciplines

The growing need for cross-domain collaboration Are your engineering teams speaking the same language? In an era of increasingly complex...
Digital transformation: Solving age-old challenges in electronics manufacturing

Digital transformation: Solving age-old challenges in electronics manufacturing

In the fast-paced electronics and semiconductor manufacturing world, one challenge has persisted for decades: the inefficient management of engineering change...
Engineer’s Corner: Real-world BOM challenges

Engineer’s Corner: Real-world BOM challenges

Navigating product variability in consumer electronics In today’s fast-paced electronics industry, managing Bills of Materials (BOMs) for products with multiple...
Bridging the gaps in electronic systems design Blog series | Closing the loop: Extending the digital thread to manufacturing – Part 4

Bridging the gaps in electronic systems design Blog series | Closing the loop: Extending the digital thread to manufacturing – Part 4

Time is the one resource that electronics companies can never have enough of. In an industry where product lifecycles are...
Bridging the gaps in electronic systems design Blog series | The key to unlocking innovation – Part 3

Bridging the gaps in electronic systems design Blog series | The key to unlocking innovation – Part 3

Did you know that companies using simulation to explore design ideas report 74% better products and 50% faster innovation? In...
Chip production and design with 3D IC technology

Chip production and design with 3D IC technology

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.
Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design – Part 2

Bridging the gaps in electronic systems design Blog series | Accelerating mechanical and electrical design - Part 2
Bridging the gaps in electronic systems design Blog series | The power of an integrated platform – Part 1

Bridging the gaps in electronic systems design Blog series | The power of an integrated platform – Part 1

In today’s rapidly evolving electronics industry, companies face unprecedented challenges in developing complex, innovative products within tight schedules and budgets....
Streamlining BOM management and product configuration in the cloud

Streamlining BOM management and product configuration in the cloud

The world of electronics product development is evolving at a rapid pace. As products become more complex and teams become...
The Engineer’s Guide to Sustainable Innovation: Balancing Cost and Carbon Footprint in Product Development

The Engineer’s Guide to Sustainable Innovation: Balancing Cost and Carbon Footprint in Product Development

Consider this: a staggering 80% of a product’s total cost, as well as its carbon footprint, are established during the...
Navigating Semiconductor Lifecycle Management: Insights and Solutions

Navigating Semiconductor Lifecycle Management: Insights and Solutions

In the rapidly evolving landscape of the semiconductor industry, we’re witnessing an unprecedented demand for devices that are not only...
Revolutionizing Your Semiconductor Journey: A Quest for Excellence

Revolutionizing Your Semiconductor Journey: A Quest for Excellence

Welcome to a transformative exploration of the semiconductor universe, where innovation meets education, and engineers are the architects of tomorrow’s...
Unlocking Test Engineering Efficiency: A Path to High Product Quality and Manufacturing Success

Unlocking Test Engineering Efficiency: A Path to High Product Quality and Manufacturing Success

In the dynamic realm of modern manufacturing, test engineers stand as the vanguard, guarding the gates of quality and engineering...
Elevating Data Centers: Practical Solutions for Greener, More Efficient Operations

Elevating Data Centers: Practical Solutions for Greener, More Efficient Operations

Imagine the energy required to power thousands of servers, keep them cool, and support the entire ecosystem of a data...
Unveiling the Beneficial Secrets of Production Costing – Siemens Webinar Recap

Unveiling the Beneficial Secrets of Production Costing – Siemens Webinar Recap

In a recent Siemens Digital Industry Software webinar, we explored the intricacies of production costing in electronics manufacturing. This recap...
Revolutionizing Product Development with Cloud CAD: A Microsoft Azure Success Story

Revolutionizing Product Development with Cloud CAD: A Microsoft Azure Success Story

Don’t have time for the full webinar right now? No problem, here are the key take-aways. Proven Impact: Making Waves...