Chevin Technology: Innovating the Automotive Industry through Siemens Cre8Ventures Automotive Marketplace
Chevin Technology, a leader in high-performance FPGA IP cores and design services, offers an innovative solution for securing silicon supply chains through its patented ChevinID© technology. This solution ensures the authentication and authorization of hardware and software functions on silicon devices, providing a secure root of trust.
ChevinID©, designed for applications across automotive, defence, telecommunications, and other critical sectors, offers protection against malicious attacks, such as hacks, counterfeits, and unauthorized intercepts. It secures silicon components from malicious actors and accidental changes, addressing vulnerabilities like zero-day exploits, memory leaks, and unmatchable threats.With the rise of quantum computing and the potential to defeat current cryptographic standards (such as RSA), ChevinID© integrates post-quantum cryptography (PQC) capabilities, offering futureproofing for hardware security.
ChevinID© is vendor-agnostic and can be integrated into FPGA, ASIC, and SiP designs, adding flexibility, security, and feature control to any silicon platform. The technology leverages Crypto Agile hardware and firmware, RTL for identification, Physical Unclonable Functions (PUF), and secure key generation and management (including PQC Key Exchange). ChevinID© prevents unauthorized access to memory and ensures that only authorized changes are made to the silicon, thus reducing the overall attack surface and offering verifiable, quantum-safe security at every stage—from fabrication through the supply chain to final applications.
Chevin Technology’s licensing model supports various formats, including soft IP licenses for FPGAs and hard IP licenses for SiP and ASIC integrations. This flexible approach allows clients to implement secure hardware solutions tailored to their specific needs, with options for both unit and subscription-based pricing.
Empowering Automotive Security
The automotive industry is increasingly embracing digital transformation, particularly in the areas of autonomous vehicles and connected systems. As vehicles become more software-driven, the security of hardware and software systems becomes paramount. By joining the Siemens Cre8Ventures Automotive Marketplace, Chevin Technology can offer the automotive sector its ChevinID© technology to ensure that vehicles’ silicon-based components are protected against threats such as cyberattacks, cloning, and hardware tampering.
This enhanced security capability aligns with the industry’s growing need for secure, scalable, and reliable digital infrastructure. With ChevinID©, automotive companies can dynamically select or modify features securely, adding another layer of protection to critical systems such as control units, sensors, and connected devices. Chevin Technology’s ability to securely manage features and differentiate products will maximize revenue streams while enhancing automotive safety and performance(ChevinIDSept23).
Contributing to the EU Chips Act Key Objectives
One of the key goals of the EU Chips Act is to achieve sovereignty over semiconductor technology and ensure Europe’s security of supply in crucial industries, including automotive. Chevin Technology’s ChevinID© solution directly supports this mission by offering a security layer that protects against vulnerabilities in the silicon supply chain, a critical concern for achieving semiconductor sovereignty.
By integrating ChevinID© into European automotive silicon systems, Chevin Technology can help the EU enhance its leadership in semiconductor innovation while protecting key industries from foreign dependencies and supply chain disruptions. The security, flexibility, and vendor independence of ChevinID© align with the EU’s strategic objectives of fostering technological autonomy, while ensuring the integrity of critical infrastructures such as automotive production(ChevinIDSept23).
New Siemens Digital Twin Use Case: Enhancing the Cohort’s Route to Product, Funding, and Market
Through Siemens’ Cre8Ventures Automotive Marketplace, Chevin Technology will also benefit from the newly introduced Siemens Digital Twin technology. Digital twins allow companies to create a virtual replica of their hardware and systems, enabling real-time testing, monitoring, and optimization before physical deployment. This technology can help cohorts like Chevin Technology, enabling partners to accelerate their route-to-product by reducing time spent in physical testing and iterations.
Additionally, digital twins streamline the route-to-funding by providing investors with clear, data-driven insights into the product’s performance, risks, and development timeline. Finally, digital twins can help automotive suppliers in their route-to-market by validating product reliability and performance in real-world conditions through simulation, thereby building trust with OEMs and customers.
By leveraging Siemens’ digital twin capabilities, Chevin Technology can significantly shorten the development cycle for their secure silicon solutions while gaining the trust and confidence of key automotive stakeholders. Together, this partnership represents a powerful contribution to the EU’s goal of semiconductor sovereignty and the evolution of secure, connected vehicles.
For more information about Dream Chip and Siemens’ Cre8Ventures, visit our website or contact Carson Bradbury, Director – EU Chips Act & Co-founder Cre8Ventures (carson.bradbury@siemens.com)
