University of Southampton ECS – Siemens Cre8venture Centre: Driving Innovation in Semiconductor Technology

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Vision and Objectives

The UK National Semiconductor Strategy and the EU Chip Act underscore the urgent need for advancements in semiconductor technology. With significant funding allocations from these initiatives, there is a clear mandate to enhance research and innovation in materials, electronic circuit designs, and system integrations. The ECS-Siemens Cre8venture partnership seeks to capitalize on this momentum by creating a Lab-to-Fab concept that combines semiconductor and design expertise to develop system-on-chip (SoC) prototypes for key applications in automotive, Industry 4.0, and the Internet of Things (IoT).

The primary objective of this centre is to establish a collaborative framework with Siemens Cre8venture, focusing on the research demands of semiconductor technologies and their applications. Two flagship projects illustrate this collaboration:

1. Heterogeneous Integration of Electronic and Sensor Systems: This project addresses the complexities of integrating discrete SoC components, focusing on innovative semiconductor device architectures and monolithic 3D integration to overcome current challenges in power management and automotive applications.
2. Beyond IoT Sensing and Low-Power Systems: This project aims to develop low-power wireless temperature sensor networks for better temperature control and monitoring in various environments, leveraging IoT communication backbones.

Operational Steps

The ECS-Siemens Cre8venture partnership is designed to streamline the transition from fundamental research to market-ready products through three key operational steps:

1. Proof-of-Technology
   • Commercializing Fundamental Research: Siemens Cre8ventures provides ECS with access to world-class EDA tools, facilitating the transition of research into pre-funded spinout start-ups.
   • Seed Funding Support: Siemens Cre8ventures aids in helping to secure non-dilutive EU Chips Act seed funding and support from UK Research and Innovation research councils, as well as introducing partner venture capitalists and Siemens Bank to fund promising projects.
   • Market Validation: Access to Siemens’ global customer base ensures that research aligns with market needs and expectations.
2. Proof-of-Concept
   • Creation of Silicon Twins: Collaborative efforts focus on developing cloud-based subsystem silicon twins for detailed validation of electronic systems.
   • Market Engagement: Feedback from target customers during prototype development helps refine designs to meet specific market needs.
3. Proof-of-Value
   • Digital Twin Validation & First Silicon: Utilizing Siemens’ digital twin technology, the practical applications and benefits of developed systems are demonstrated, providing robust evidence of their performance.
   • Industry Collaboration: Working with industrial partners to transition prototypes to TRL 6 and beyond ensures secure and supportive environments for developing new electronic systems.

Conclusion

The ECS-Siemens Cre8venture Centre exemplifies a strategic partnership aimed at advancing semiconductor research and innovation. By following a structured approach from proof-of-technology to proof-of-value, this collaboration not only accelerates the development process but also ensures the resulting technologies are technically viable and commercially valuable. The success of this initiative will significantly contribute to the growth of knowledge-based economies and the broader technological landscape.

This partnership is a testament to the power of collaboration in driving technological advancement and addressing the critical challenges facing the global semiconductor industry today.

For more information about Dream Chip and Siemens’ Cre8Ventures, visit our website or contact Carson Bradbury, Director – EU Chips Act & Co-founder Cre8Ventures (carson.bradbury@siemens.com)