ATLANT3D Partners with Siemens Cre8Ventures to Revolutionize Semiconductor Manufacturing
In the fast-paced and constantly evolving semiconductor industry, innovation is crucial for staying ahead. ATLANT 3D, recognized for its groundbreaking work in digital atomic-layer advanced manufacturing of nano- and micro-devices, has teamed up with Siemens Cre8Ventures and its PAVE360 Digital Twin Marketplace. This strategic partnership aims to give participants access to a unique lab-to-fab platform, facilitating the smooth transition from research and development to large-scale manufacturing. This collaboration also aligns perfectly with the objectives of the EU Chips Act, which aims to strengthen Europe’s semiconductor industry.
A Powerful Collaboration: ATLANT3D and Siemens Cre8Ventures
ATLANT 3D is at the forefront of developing advanced atomic-layer processing technologies specifically designed for the semiconductor industry. Their innovative methods enable precise and efficient production of complex semiconductor components. By partnering with Siemens Cre8Ventures, a venture dedicated to fostering technological innovation, ATLANT 3D gains access to a vast network of resources and expertise, significantly boosting their capabilities and market reach.
Siemens’ PAVE360 Digital Twin Marketplace enhances this partnership even further. PAVE360 offers a comprehensive simulation environment for designing, testing, and validating semiconductor devices.
This digital twin technology creates a virtual replica of the physical world, allowing for precise modelling and analysis and reducing the need for costly and time-consuming physical prototypes.
The Unique Lab-to-Fab Platform
The core of this partnership is the lab-to-fab platform, a revolutionary approach designed to streamline the transition from laboratory innovation to full-scale manufacturing. This platform equips users with the tools and infrastructure to move seamlessly from research and development to production.
Key features of the lab-to-fab platform include:
- Integrated Simulation and Design Tools: Using world-class EDA tools and the PAVE360 Digital Twin Marketplace, users can design and simulate their semiconductor devices in a highly accurate virtual environment, enabling rigorous testing and optimization before physical production.
- Advanced Additive Manufacturing: ATLANT 3D’s state-of-the-art Digital Atomic Layer Processing (DALP) platform allows rapid prototyping and the production of intricate semiconductor components with unmatched precision.
- Scalable Production Solutions: The platform supports scalable manufacturing processes, ensuring that innovations can efficiently transition to high-volume production.
Supporting the EU Chips Act Objectives
The EU Chips Act is a strategic initiative aimed at enhancing Europe’s semiconductor capabilities, ensuring supply chain security, and driving technological leadership. The partnership between ATLANT 3D, Siemens Cre8Ventures, and the PAVE360 Digital Twin Marketplace plays a crucial role in achieving these goals:
- Boosting Production Capacity: By facilitating the seamless transition from design to manufacturing, the platform helps increase semiconductor production capacity, supporting the EU’s ambition to double its global chip production share by 2030.
- Driving Innovation: The integration of advanced simulation and atomic-layer manufacturing technologies promotes innovation, positioning Europe as a leader in semiconductor technology development.
- Enhancing Supply Chain Security: By improving local production capabilities, the partnership reduces reliance on external sources, contributing to a more secure and resilient semiconductor supply chain.
The collaboration between ATLANT 3D, Siemens Cre8Ventures, and the PAVE360 Digital Twin Marketplace represents a significant advancement in semiconductor manufacturing. By providing participants with access to a unique lab-to-fab platform, this partnership accelerates innovation and supports the strategic objectives of the EU Chips Act. As Europe strives to strengthen its position in the global semiconductor market, synergistic partnerships will be crucial in driving progress and achieving long-term success.
This partnership sets a new standard for the semiconductor industry, showcasing the power of collaboration and technological innovation in meeting the demands of the future. Through this initiative, ATLANT 3D and Siemens Cre8Ventures are not just advancing technology but also contributing to the broader goals of economic resilience and technological sovereignty in Europe.
For more information about Dream Chip and Siemens’ Cre8Ventures, visit our website or contact Carson Bradbury, Director – EU Chips Act & Co-founder Cre8Ventures (carson.bradbury@siemens.com)
