What’s new in Xpedition Enterprise Release VX.2.12

What’s new in Xpedition Enterprise release VX.2.12

The new VX.2.12 release of Xpedition has improvements across four key areas: design capture, layout, library and data management, and…

image of an icon representing rigid-flex design

Meeting rigid-flex design challenges with Xpedition

In addition to the usual PCB design challenges, flex and rigid-flex PCB designers are faced with a long list of…

Blog alternate electronic components

Can you accelerate the selection of alternate components?

This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout…

electronic components sourcing blog

The engineer and the electronic component sourcing process – how to streamline that today and streamline BOM verification

This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout…

IESF 2022

Check out the new PCB track at IESF 2022

IESF Automotive is organized by Siemens Digital Industries Software and has been a must-attend event for automotive E/E design professionals…

Resources for learning about PCB design

With today’s complex requirements challenging us at almost every stage of the design process, we don’t always have the answers…

TESAT: Launching high-density space designs better and faster with stellar collaboration tools

Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…

New 3D IC Podcast Launch

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

3D IC takes a village but must start with a netlist

In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…