The new VX.2.12 release of Xpedition has improvements across four key areas: design capture, layout, library and data management, and…
In addition to the usual PCB design challenges, flex and rigid-flex PCB designers are faced with a long list of…
This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout…
IESF Automotive is organized by Siemens Digital Industries Software and has been a must-attend event for automotive E/E design professionals…
With today’s complex requirements challenging us at almost every stage of the design process, we don’t always have the answers…
Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…
NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…
In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…
