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What’s the fastest-growing area of semiconductor packaging?

HDAP! No longer reliant on the mobile market alone, High Density Advanced Packaging (HDAP) has…

PCB Tech Talk Podcast: Evolving and Emerging Technologies

In the age of the Internet of Things (IoT), ‘smart’ technologies have gone far beyond…

What’s New in Xpedition – FPGA-PCB Co-Design

In the last What’s New in Xpedition blog post, we reviewed the new schematic capture…

What’s New in Xpedition – Schematic Capture

In the last What’s New in Xpedition blog post we reviewed the new multi-board system…

What’s New in Xpedition – System Design

In the previous What’s New in Xpedition blog post, we reviewed the new data management…

PCB Tech Talk Podcast: Can Electrical Sign-off be Automated?

Electrical sign-off has become, more than ever, a critical part of the PCB design process….

What’s New in Xpedition – Data Management

In the first What’s New in Xpedition blog post, we reviewed how the Xpedition VX.2…

PCB Tech Talk Podcast: 7 Habits of Highly Efficient PCB Designers

Designing a PCB is similar to a complex puzzle, except there’s no picture on the…

What’s New in Xpedition?

The latest release of Xpedition® Enterprise, VX.2.3, is now available for download. What does this…