{"id":8732,"date":"2013-05-29T21:51:11","date_gmt":"2013-05-30T04:51:11","guid":{"rendered":"https:\/\/blogs.mentor.com\/verificationhorizons\/?p=8732"},"modified":"2026-03-27T08:43:20","modified_gmt":"2026-03-27T12:43:20","slug":"ieee-1801-2013-upf-standard-is-published","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2013\/05\/29\/ieee-1801-2013-upf-standard-is-published\/","title":{"rendered":"IEEE 1801\u2122-2013 UPF Standard Is Published"},"content":{"rendered":"

Download the standard now \u2013 at no charge<\/h3>\n

The IEEE Standards Association (IEEE-SA) has published the latest UPF 2.1 standard, officially called IEEE Standard for Design and Verification of Low-Power Integrated Circuits,<\/em> many refer to it as IEEE 1801 or UPF for the Unified Power Format as this was the name Accellera had given it prior to transferring standardization responsibility and ongoing maintenance and enhancement to the IEEE.\u00a0 Further – Courtesy of Accellera \u2013 the standard is available for download without charge directly from the IEEE.<\/p>\n

\"1801-2013_Page_001\"<\/a>The latest update to IEEE 1801 is ready for download<\/a>.\u00a0 It joins other EDA standards, like SystemVerilog<\/a> and SystemC<\/a> in the IEEE Get\u2122<\/a> program that grants public access to view and download current individual standards at no charge as a PDF.\u00a0 (If you wish to have an older, superseded and withdrawn version of the standard or if you wish to have a printed copy or have it in a CD-ROM format, you can purchase older and alternate formats from IEEE for a fee.)<\/p>\n

The official IEEE announcement on the standard\u2019s publication can be found here<\/a>.\u00a0 And the official Accellera announcement that it has partnered with the IEEE-SA to offer the standard to all at no charge can be found here<\/a>.\u00a0 This revision of the standard had one of the largest number of IEEE-SA entity members of any corporate standards program.\u00a0 Participation from the IEEE-SA global community of entity participants ensures the needs of a broad set of companies are captured to support this worldwide standard.<\/p>\n

Just In Time For DAC<\/h3>\n

\"50th<\/a>DAC 2013 has many events that will allow you to learn more about the new standard and how to use it to your maximum benefit.\u00a0 And for those who cannot attend DAC, visit the Verification Academy, you will find the Low Power sessions<\/a> cover the new standard as well. [Registration required; restrictions apply.]<\/p>\n

Sunday<\/span><\/strong>
\nTopic:<\/strong> DAC Workshop:\u00a0 Low-Power Design with the New IEEE 1801-2013 Standard
\nDate:<\/strong> 2 June 2013
\nTime:<\/strong> 1:00 p.m. \u2013 5:00 p.m.
\nLocation:<\/strong> Convention Center: Room 18C
\nRegistration:<\/strong> Official DAC Workshop registration required ($). For more information and to register, click here<\/a>.<\/p>\n

\n

Monday<\/span><\/strong>
\nAccellera Breakfast & Town Hall Meeting
\nTopic:<\/strong> The Standard for Low Power Design and Verification is here!\u00a0 What\u2019s next?
\nDate:<\/strong> 3 June 2013
\nTime:<\/strong> 7:00 a.m. \u2013 8:45 a.m.
\nLocation:<\/strong> Convention Center: Ballroom D
\nRegistration:<\/strong> This is a free Accellera event, but registration is required.\u00a0 Form more information click here<\/a> and to register, click here<\/a>.<\/p>\n

\n

Monday <\/span><\/strong>
\nVerification Academy
\nTopic:<\/strong> \u201cLow Power Monday\u201d
\nDate:<\/strong> 3 June 2013
\nTime:<\/strong> 11:00 a.m. \u2013 6:00 p.m.
\nLocation:<\/strong> Tradeshow Floor \u2013 Booth 1215
\nRegistration:<\/strong> The DAC Tradeshow floor is open to all DAC registrants. Visit www.dac.com<\/a> to register.<\/p>\n

The Verification Academy is open to all DAC registrants.\u00a0 There are no restrictions and we invite everyone to visit booth 1215 for Low Power sessions that may be of interest to you on Monday.\u00a0 To help judge attendance, please feel free to pre-register at here<\/a>.\u00a0 I look forward to see you there as you will find me here most of the time Monday-Wednesday.<\/p>\n\n\n\n\n\n\n\n\n
<\/td>\nTime <\/span><\/strong><\/td>\nDescription <\/span><\/strong><\/td>\nPresenter<\/span><\/strong><\/td>\n<\/tr>\n
<\/td>\n11:00 a.m. \u2013 12:00 p.m.<\/td>\nLow Power Verification<\/td>\nTim Jordon
\nMicroChip Technlogy<\/td>\n<\/tr>\n
<\/td>\n1:00 p.m. \u2013 2:00 p.m<\/td>\nWhat\u2019s New in UPF 2.1?<\/td>\nErich Marschner
\nIEEE 1801 Vice-chair
\nMentor Graphics<\/td>\n<\/tr>\n
<\/td>\n2:00 p.m. \u2013 3:00 p.m.<\/td>\nUPF-Based Verification for Cypress PSOC<\/td>\nEllie Burns
\nMentor Graphics<\/td>\n<\/tr>\n
<\/td>\n4:00 p.m. \u2013 5:00 p.m.<\/td>\nOptimizing for Power Efficient Design<\/td>\nAbhishek Ranjan
\nCalypto<\/td>\n<\/tr>\n
<\/td>\n5:00 p.m. \u2013 6:00 p.m.<\/td>\nIEEE 1801 UPF Commands and Methodology<\/td>\nJohn Biggs
\nARM
\nIEEE 1801 Chair<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n
\n

If you are coming to DAC and participating in the DAC Low Power Workshop on Sunday, or in other events, download your person copy of the new IEEE 1800-2013 standard today.\u00a0 The PDF form allows you to take it with you and read it using your favorite e-reader or i-device.\u00a0 Let\u2019s me know what you think of the standard.\u00a0 And \u2013 See you at DAC!<\/p>\n","protected":false},"excerpt":{"rendered":"

Download the standard now \u2013 at no charge The IEEE Standards Association (IEEE-SA) has published the latest UPF 2.1 standard,…<\/p>\n","protected":false},"author":71541,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[326,409,535,537,539,577,732,785],"industry":[],"product":[],"coauthors":[],"class_list":["post-8732","post","type-post","status-publish","format-standard","hentry","category-news","tag-accellera","tag-dac","tag-ieee-1801","tag-ieee-get","tag-ieee-standards-association","tag-low-power","tag-standards","tag-upf"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/8732","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/users\/71541"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/comments?post=8732"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/8732\/revisions"}],"predecessor-version":[{"id":14609,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/8732\/revisions\/14609"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media?parent=8732"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/categories?post=8732"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/tags?post=8732"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/industry?post=8732"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/product?post=8732"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/coauthors?post=8732"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}