{"id":19418,"date":"2025-06-17T23:58:05","date_gmt":"2025-06-18T03:58:05","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/?p=19418"},"modified":"2026-03-27T08:53:47","modified_gmt":"2026-03-27T12:53:47","slug":"industrial-grade-ai-in-eda-from-promise-to-practice-a-siemens-panel-at-dac-2025","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2025\/06\/17\/industrial-grade-ai-in-eda-from-promise-to-practice-a-siemens-panel-at-dac-2025\/","title":{"rendered":"Industrial-Grade AI in EDA: From Promise to Practice \u2014 A Siemens Panel at DAC 2025"},"content":{"rendered":"\n

The AI revolution is reshaping everything from entertainment to enterprise software \u2014 but what does it take to bring artificial intelligence into the high-stakes, precision-driven world of electronic design automation (EDA)? That\u2019s the central question behind a standout DAC 2025 panel hosted by Siemens EDA: “Achieving Industrial-Grade AI in EDA: Challenges, Lessons, and Opportunities<\/a>.”<\/p>\n\n\n\n

\ud83d\udcc5\u00a0When:<\/strong>\u00a0Monday, June 23, 4:30\u20135:15 PM
\ud83d\udccd\u00a0Where:<\/strong>\u00a0Room 2004, Level 2
\ud83c\udfa4\u00a0Moderator:<\/strong>\u00a0John Linford, NVIDA<\/p>\n\n\n\n

What to Expect<\/strong><\/h3>\n\n\n\n

While many industry panels discuss AI in EDA in a narrowly focused application or technology, this one is different \u2014 not only in depth but in\u00a0perspective<\/strong>. Moderated by\u00a0NVIDIA\u2019s John Linford<\/strong>, a respected expert bridging AI and high-performance design, the conversation will be fueled by\u00a0executive leaders from across Siemens EDA\u2019s broad portfolio<\/strong>. These aren\u2019t outside commentators \u2014 they are the GMs directly responsible for architecting, implementing, and scaling AI within the industry\u2019s most advanced verification, digital, analog, DFT, and system design tools.<\/p>\n\n\n\n

Representing the full span of the EDA lifecycle, Siemens panelists include:<\/p>\n\n\n\n

    \n
  • Jean-Marie Brunet<\/strong>, VP & GM Hardware-Assisted Verification, Siemens EDA<\/li>\n\n\n\n
  • Amit Gupta<\/strong>\u00a0\u2013 VP & GM Custom IC Division, Siemens EDA<\/li>\n\n\n\n
  • Ankur Gupta<\/strong>\u00a0\u2013 Senior VP & GM Digital Design Creation Platform, Siemens EDA<\/li>\n\n\n\n
  • AJ Incorvaia<\/strong>\u00a0\u2013 Senior VP, Electron Board Systems, Siemens EDA<\/li>\n\n\n\n
  • Abhi Kolpekwar<\/strong>\u00a0\u2013 VP & GM, Digital Verification Technologies, Siemens EDA<\/li>\n\n\n\n
  • Juan Rey<\/strong>\u00a0\u2013 Senior VP & GM, Calibre, Siemens EDA<\/li>\n<\/ul>\n\n\n\n

    Together, they bring a\u00a0cross-domain view<\/strong>\u00a0of AI adoption, showing how different technologies \u2014 from classical ML to GenAI and emerging agentic AI \u2014 are being deployed to solve domain-specific challenges across tools, flows, and abstraction levels.<\/p>\n\n\n\n

    More Than Just Chatbots: Reframing the AI Maturity Conversation<\/strong><\/h3>\n\n\n\n

    This panel will trace AI\u2019s journey in EDA by technology type and practical value:<\/p>\n\n\n\n

      \n
    • ML and statistical techniques<\/strong>\u00a0already embedded in tools today for faster bug prediction, regression reduction, and design optimization.<\/li>\n\n\n\n
    • LLMs and GenAI<\/strong>\u00a0entering the flow for code generation, log summarization, and specification comprehension \u2014 with caveats.<\/li>\n\n\n\n
    • Agentic AI<\/strong>\u00a0in early stages, with high potential to drive flow orchestration, root-cause analysis, and tool-to-tool automation.<\/li>\n\n\n\n
    • Lessons learned<\/strong>\u00a0from what\u2019s worked \u2014 and what hasn\u2019t \u2014 in real-world adoption.<\/li>\n<\/ul>\n\n\n\n

      And through it all, a clear-eyed look at what it means to build industrial-grade AI<\/strong>: AI that is explainable, reliable, and safe enough<\/strong> for mission-critical hardware design.<\/p>\n\n\n\n

      Why This Panel Matters<\/strong><\/h3>\n\n\n\n

      AI in EDA isn\u2019t about hype. It\u2019s about hard-won insights, tough engineering tradeoffs, and building trust in automation. This panel brings together the executive leaders actually making that real<\/strong> \u2014 not in five years, but right now.<\/p>\n\n\n\n

      So if you’re curious about the real<\/em> state of AI in chip design \u2014 from verification and DFT to analog and physical \u2014 don\u2019t miss this one. You\u2019ll walk away with a more nuanced understanding of where we are, where we\u2019re going, and how Siemens EDA is helping to lead the way.<\/p>\n","protected":false},"excerpt":{"rendered":"

      Industrial-Grade AI in EDA<\/p>\n","protected":false},"author":71592,"featured_media":19420,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5,1],"tags":[1633,1622],"industry":[54,1564,55,53,56,57],"product":[1046,79,80,1048,1050,1593,90,103,104,1055,147,148,149,150,151,152,1070,1071,156,157,1075,1084,186,1085,1086,187,1087,205,1606,206,207,1091,208,209,269,1122,273,274,275,276,277,278,279,280,281,282,1123,1124,286],"coauthors":[967],"class_list":["post-19418","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","category-news","tag-ai-in-eda","tag-ai-ml","industry-consumer-industrial-electronics","industry-electronic-design-automation","industry-electronic-manufacturing-services","industry-electronics-semiconductors","industry-semiconductor-devices","industry-semiconductor-equipment","product-analog","product-analog-fastspice-afs","product-analog-mixed-signal-ams","product-aprisa","product-austemper","product-avery","product-calibre","product-catapult","product-catapult-coverage","product-catapult-formal-and-slec-system","product-mentor-embedded-hypervisor","product-mentor-embedded-iot","product-mentor-embedded-linux","product-mentor-embedded-linux-omni-os","product-mentor-embedded-multicore-framework","product-mentor-standard-licensing","product-mentor-embedded-hypervisor-2","product-mentor-embedded-multicore-framework-2","product-modelsim","product-modelsim-oem-editions","product-onespin","product-pads-pro-student-edition","product-pads-professional","product-pads-professional-xcr","product-pads-standard-xcr","product-pads-standard-standard-plus","product-pcbflow","product-questa","product-questa-formal","product-questa-verification-ip","product-questa-verification-ip-oem-editions","product-questa-verification-iq","product-questasim-oem-editions","product-quicksim","product-tessent","product-tessent-embedded-analytics","product-valor-dft","product-valor-iot-manufacturing-valor-mss-shop-floor","product-valor-npi","product-valor-parts-library","product-valor-process-preparation","product-valor-production-plan-line-executive","product-veloce","product-veloce-prototyping-system","product-veloce-software-debug","product-veloce-vipr","product-veloce-x-step","product-visualizer","product-visualizer-debug-environment"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2025\/06\/HF-Video-AI.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/19418","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/users\/71592"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/comments?post=19418"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/19418\/revisions"}],"predecessor-version":[{"id":19423,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/19418\/revisions\/19423"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media\/19420"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media?parent=19418"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/categories?post=19418"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/tags?post=19418"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/industry?post=19418"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/product?post=19418"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/coauthors?post=19418"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}