{"id":17379,"date":"2022-06-21T00:07:05","date_gmt":"2022-06-21T04:07:05","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/?p=17379"},"modified":"2026-03-27T08:49:07","modified_gmt":"2026-03-27T12:49:07","slug":"dac-2022-the-digital-twin-reimagined-one-model-to-rule-them-all","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2022\/06\/21\/dac-2022-the-digital-twin-reimagined-one-model-to-rule-them-all\/","title":{"rendered":"DAC 2022: The Digital Twin Reimagined &#8211; One Model To Rule Them All?"},"content":{"rendered":"\n<p>To many of us in the EDA world, using the term \u201cdigital twin\u201d to describe how customers\u2019 electronically model their designs is very familiar \u2013 blindingly obvious, even. Indeed, there have been practical, high fidelity digital twins in the semiconductor and software worlds for many years. So what\u2019s the big deal about \u201cDigital Twins\u201d today? The answer lies in two new trends:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Digital electronics (and the corresponding software stacks) are becoming a much, much larger percentage of products that historically had purely electro-mechanical control systems<\/li><li>The connective interfaces between CAD worlds \u2013 analog, digital, software, mechanical, cooling and Computational Fluid Dynamics (CFD), et.al. \u2013 present a host of opportunities for new standards to exchange data from the system level, down the software stack, and to the underlying electronics<\/li><\/ul>\n\n\n\n<p>Simply stated: the world outside of our digital semiconductor and systems bubble is finally going through the sort of digital transformation that we have. And this is great news for all of us because we have this experience to apply to digitally represent complex products across the entire product lifecycle in order to increase efficiency, confidence, and profitability. This need will only grow as products become increasingly intelligent and electrified.<\/p>\n\n\n\n<p>Skeptical? Imagine that your company is creating a next-generation embedded computer for a land vehicle, robot, aircraft, or even a consumer device like a TV. The sooner you can verify the inter-mixing domains meet or exceed the myriad of interwoven specs, the better. Hence, a common project need would be to run real-world scenarios of a processor\u2019s instruction flow on <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/article-emulation-centric-power-analysis-of-soc-designs\" target=\"_blank\" rel=\"noreferrer noopener\">an emulator to get the dynamic power consumption profile of an end-user app<\/a>, which in-turn provides data to <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/simulation-test\/fluid-dynamics-simulation.html\" target=\"_blank\" rel=\"noreferrer noopener\">a CFD tool to influence the choice of a fan, cold plate, or heat sink in the end-product\u2019s chassis<\/a>; but <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/nx\/\" target=\"_blank\" rel=\"noreferrer noopener\">within the physical package size and materials specs<\/a>.<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<p><a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=FEDES128&amp;sess=sess185\" target=\"_blank\" rel=\"noreferrer noopener\">On Wednesday, July 13<sup>th<\/sup> 3:30pm &#8211; 5:00pm PDT at the upcoming DAC 2022, NXP Semiconductors\u2019 Martin Barnasconi will moderate a panel to discuss all this:<\/a><\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>The characteristics of digital twins across the development, manufacture, and operation stages of a product lifecycle with a specific focus on how the increasing reliance on electronics in products affects these digital twins<\/li><li>Opportunities enabled by digital twins to do more with less within each CAD vertical, and proposals for how to efficiently integrate the different models and\/or frameworks to shape the digital twin ecosystem<\/li><li>Where this needs to evolve in the next 3-5 years to help solve customers\u2019 NP-hard problems (air and land-based autonomous vehicles, healthcare automation, etc.)<\/li><\/ul>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\"><div class=\"wp-block-image is-style-default\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"226\" height=\"300\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/06\/martin_barnasconi-nxp-226x300-1.jpg\" alt=\"\" class=\"wp-image-17382\"\/><\/figure><\/div><\/div>\n<\/div>\n\n\n\n<p>The panelists &#8212; Bryan Ramirez, Siemens EDA; Manfred Thanner, NXP Semiconductors; Fred Hannert, General Motors \u2013 represent the full spectrum of EDA tool, semiconductor, and systems makers.<\/p>\n\n\n\n<p>This event will be in area 2010, Level 2 \u2013 all you need is the basic DAC expo pass \u2013 <a href=\"https:\/\/www.dac.com\/Attend\/Registration\" target=\"_blank\" rel=\"noreferrer noopener\">register for this here.<\/a><\/p>\n\n\n\n<p>We hope to see you there!<\/p>\n\n\n\n<p>Joe Hupcey,<br>for the Siemens EDA team<\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><strong>Reference links:<\/strong><\/p>\n\n\n\n<p><a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=FEDES128&amp;sess=sess185\" target=\"_blank\" rel=\"noreferrer noopener\">Official DAC 2022 landing page for this panel<\/a><\/p>\n\n\n\n<p><\/p>\n\n\n\n<p><a href=\"Disciplines to deliver a comprehensive digital twin\" target=\"_blank\" rel=\"noreferrer noopener\">Whitepaper: Disciplines to deliver a comprehensive digital twin<\/a> &#8212; How Siemens EDA paired with PLM is breaking down the barriers between engineering disciplines to deliver a comprehensive digital twin<a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=FEDES128&amp;sess=sess185\" target=\"_blank\" rel=\"noreferrer noopener\"><br><\/a><\/p>\n\n\n\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2022\/06\/15\/dac-2022-siemens-eda-experts-share-practical-cloud-solutions\/\" target=\"_blank\" rel=\"noreferrer noopener\">DAC 2022: Siemens EDA Experts Share Practical Cloud Solutions<br><\/a><\/p>\n\n\n\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2022\/05\/18\/siemens-eda-at-the-59th-design-automation-conference\/\" target=\"_blank\" rel=\"noreferrer noopener\">Siemens EDA at the 59th Design Automation Conference<\/a><\/p>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>To many of us in the EDA world, using the term \u201cdigital twin\u201d to describe how customers\u2019 electronically model their&#8230;<\/p>\n","protected":false},"author":71594,"featured_media":17381,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[1044,22,506],"industry":[],"product":[],"coauthors":[931],"class_list":["post-17379","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-dac-2022-2","tag-digital-twin","tag-functional-verification"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/06\/Electronics-Digital-Twin-Generic-Deep-Blue_original.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17379","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/users\/71594"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/comments?post=17379"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17379\/revisions"}],"predecessor-version":[{"id":17384,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17379\/revisions\/17384"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media\/17381"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media?parent=17379"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/categories?post=17379"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/tags?post=17379"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/industry?post=17379"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/product?post=17379"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/coauthors?post=17379"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}