{"id":17289,"date":"2022-05-18T15:02:43","date_gmt":"2022-05-18T19:02:43","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/?p=17289"},"modified":"2026-03-27T08:48:59","modified_gmt":"2026-03-27T12:48:59","slug":"siemens-eda-at-the-59th-design-automation-conference","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2022\/05\/18\/siemens-eda-at-the-59th-design-automation-conference\/","title":{"rendered":"Siemens EDA at the 59th Design Automation Conference"},"content":{"rendered":"\n<p>Mark your calendars for the upcoming <a href=\"https:\/\/www.dac.com\/\" target=\"_blank\" rel=\"noopener\">59<sup>th<\/sup> Design Automation Conference<\/a>, and welcome back to the beautiful city by the bay\u2014San Francisco! The 59<sup>th<\/sup> DAC will be held at the Moscone Center West from July 10-14, 2022. I have had the honored of serving as this year\u2019s DAC Past Chair and working with the DAC executive committee I feel we have put together a remarkable technical program.<\/p>\n\n\n\n<p>DAC has always been a unique event and this year is no exception. After all, DAC is the only event that brings together the entire design and automation ecosystem, which includes academic and industrial researchers, electronic executives and managers, IC and systems designers and developers, educators, and of course vendors.<\/p>\n\n\n\n<figure class=\"wp-block-image size-medium\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"286\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-600x286.png\" alt=\"\" class=\"wp-image-17291\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-600x286.png 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-1024x488.png 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-768x366.png 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-1536x732.png 1536w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-2048x976.png 2048w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag-900x429.png 900w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n\n\n\n<p>For the 59<sup>th<\/sup>\u00a0DAC, Siemens is a Platinum exhibitor, and our booth is located at #2521. In addition to our exhibits,\u00a0<a href=\"https:\/\/59dac.conference-program.com\/organization\/?inst=4040575558713017072\" target=\"_blank\" rel=\"noopener\">Siemens EDA has 30 active participants in the technical program<\/a>, which includes:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>1 SKYTalk (Short Keynote)<\/li><li>1 Invited Engineering Track Talk<\/li><li>10 Engineering Track Presentations<\/li><li>4 Engineering Track Posters<\/li><li>1 Research Track Work-in-Progress Poster<\/li><\/ul>\n\n\n\n<p>In this blog I plan to highlight a few of the key Siemens EDA DAC program events.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"200\" height=\"201\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/JoeSawicki.jpg\" alt=\"\" class=\"wp-image-17292\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/JoeSawicki.jpg 200w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/JoeSawicki-150x150.jpg 150w\" sizes=\"auto, (max-width: 200px) 100vw, 200px\" \/><\/figure>\n\n\n\n<p>The first event I want to highlight is an invited SKYTalk (short keynote) given by Joe Sawicki, Executive Vice President IC EDA, Siemens. Joe\u2019s talk, titled&nbsp;<a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=SKY104&amp;sess=sess269\" target=\"_blank\" rel=\"noopener\">Delivering \u201cSmarter\u201d Faster: The Future of EDA &amp; AI<\/a>, will survey the substantial improvement reaped thus far from incorporating AI\/ML into EDA toolsets. Joe\u2019s talk is scheduled for Monday, July 11<sup>th<\/sup> at 1:00pm PST in the DAC Pavilion.<\/p>\n\n\n\n<p>The second event I want to highlight is an invited Engineering Track talk by Bryan Rameriz, Director Industries, Solutions &amp; Ecosystems, Siemens EDA\u200b, and is titled\u00a0<em>Introduction to Digital Twins and the Intersection with Electronics<\/em>\u200b.  This talk is part of the special invited session titled <a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=FEDES128&amp;sess=sess185\" target=\"_blank\" rel=\"noopener\">Digital Twin Reimagined &#8211; One Model To Rule Them All?<\/a>, which is scheduled for Wednesday, July 13<sup>th<\/sup>\u00a0at 3:30pm PST. This session focuses on the opportunities as well as the challenges of bringing together Digital Twin technologies with semiconductor, electronics HW and SW development techniques.<\/p>\n\n\n\n<p>The third event I want to highlight is a tutorial titled <a href=\"https:\/\/59dac.conference-program.com\/presentation\/?id=TUT103&amp;sess=sess198\" target=\"_blank\" rel=\"noopener\">Hardware\/Software Co-design with High-Level Synthesis<\/a>, which is scheduled for Monday, July 11th1:30pm PDT. Siemens EDA\u2019s Sadhvi Praveen and Russell Klein will demonstrate today\u2019s High-Level Synthesis transformation on an example algorithm from a full software implementation to a high performance, efficient implementation with a mix of hardware and software elements.<\/p>\n\n\n\n<p>The following is a full listing of Siemens EDA technical participation within this year\u2019s DAC program:<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td>SKYTalk<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=SKY104&amp;sess=sess269\" target=\"_blank\" rel=\"noopener\">Delivering \u201cSmarter\u201d Faster: The Future of EDA &amp; AI<\/a><\/td><\/tr><tr><td>Invited Engineering Track Talk<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=FEDES128&amp;sess=sess185\" target=\"_blank\" rel=\"noopener\">Digital Twin Reimagined &#8211; One Model To Rule Them All ?<\/a><\/td><\/tr><tr><td>Tutorial<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=TUT103&amp;sess=sess198\" target=\"_blank\" rel=\"noopener\">Hardware\/Software Co-design with High-Level Synthesis<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP114&amp;sess=sess171\" target=\"_blank\" rel=\"noopener\">A hierarchical and tractable Mixed Signal verification methodology for first-generation Analog AI Processors<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=BEDES121&amp;sess=sess169\" target=\"_blank\" rel=\"noopener\">Characterization Challenges in System Level IO Interface<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP101&amp;sess=sess158\" target=\"_blank\" rel=\"noopener\">Creating Robust EDA and IP Ecosystems to Strengthen the Global Semiconductor Supply Chain<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP109&amp;sess=sess171\" target=\"_blank\" rel=\"noopener\">Design for Manufacturability (DFM) for Analog IP<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=BEDES128&amp;sess=sess165\" target=\"_blank\" rel=\"noopener\">Machine Learning and EDA: The Productivity Cycle<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP110&amp;sess=sess172\" target=\"_blank\" rel=\"noopener\">Efficient use of on-line LogicBIST to achieve ASIL B in a GPU IP<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=BEDES119&amp;sess=sess168\" target=\"_blank\" rel=\"noopener\">Experimental Validation of a Novel Methodology for Electromigration Assessment in On-chip Power Grids<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP111&amp;sess=sess171\" target=\"_blank\" rel=\"noopener\">Frequency synthesizers with a purpose in advanced process technologies<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=ETPOST184&amp;sess=sess187\" target=\"_blank\" rel=\"noopener\">Integrating Liberty model validation, analysis, and visualization as part of library design and characterization<\/a><\/td><\/tr><tr><td>Engineering Tracks<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=IP108&amp;sess=sess172\" target=\"_blank\" rel=\"noopener\">Variation-Aware Design Verification For Automotive Semiconductor IP<\/a><\/td><\/tr><tr><td>Engineering Track Poster<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=ETPOST109&amp;sess=sess246\" target=\"_blank\" rel=\"noopener\">A unified IP QA methodology to improve validation coverage and throughput<\/a><\/td><\/tr><tr><td>Engineering Track Poster<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=ETPOST191&amp;sess=sess187\" target=\"_blank\" rel=\"noopener\">Automated DCAP and filler cell insertion with embedded Design for Inspection (DFI) Sensors<\/a><\/td><\/tr><tr><td>Engineering Track Poster<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=ETPOST143&amp;sess=sess188\" target=\"_blank\" rel=\"noopener\">Chatbot as a Virtual Assistant to Retrieve Information from Datasheets<\/a><\/td><\/tr><tr><td>Engineering Track Poster<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=ETPOST209&amp;sess=sess188\" target=\"_blank\" rel=\"noopener\">Improving Power Grid IR drop with an automated layout enhancement flow<\/a><\/td><\/tr><tr><td>Work-in-Progress Poster<\/td><td><a href=\"https:\/\/59dac.conference-program.com\/?post_type=page&amp;p=13&amp;id=WIP177&amp;sess=sess263\" target=\"_blank\" rel=\"noopener\">What Helper Data Really Leaks: A Practical Approach to Estimate the Min-Entropy in PUFs Using Their Response Mass Function<\/a><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>You can learn more about&nbsp;<a href=\"https:\/\/59dac.conference-program.com\/organization\/?inst=4040575558713017072\" target=\"_blank\" rel=\"noopener\">Siemens EDA technical participation at this year\u2019s DAC<\/a>&nbsp;by visiting the online program. In addition, visit&nbsp;<a href=\"http:\/\/www.dac.com\/\" target=\"_blank\" rel=\"noopener\">www.dac.com<\/a>&nbsp;for a full listing of all events at this year\u2019s 59<sup>th<\/sup>&nbsp;DAC!<\/p>\n\n\n\n<p>Finally, check with <a href=\"https:\/\/events.sw.siemens.com\/en-US\/\" target=\"_blank\" rel=\"noopener\">Siemens Digital Industries Software Events<\/a> to learn more about what is happening in the Siemens EDA booth!<\/p>\n\n\n\n<p>Oh, and act now,&nbsp;<a href=\"https:\/\/www.dac.com\/Attend\/Registration\" target=\"_blank\" rel=\"noopener\">free I LOVE DAC advance registration<\/a>&nbsp;ends on June 10<sup>th<\/sup>, 2022! General advance registration also ends on July 10<sup>th<\/sup>, 2021.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Mark your calendars for the upcoming 59th Design Automation Conference, and welcome back to the beautiful city by the bay\u2014San&#8230;<\/p>\n","protected":false},"author":71592,"featured_media":17291,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[1036,452,715],"industry":[],"product":[],"coauthors":[967],"class_list":["post-17289","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-59dac","tag-eda","tag-siemens"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/54\/2022\/05\/DAC_59_tag.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17289","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/users\/71592"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/comments?post=17289"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17289\/revisions"}],"predecessor-version":[{"id":17297,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/17289\/revisions\/17297"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media\/17291"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media?parent=17289"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/categories?post=17289"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/tags?post=17289"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/industry?post=17289"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/product?post=17289"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/coauthors?post=17289"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}