{"id":1368,"date":"2010-06-03T15:28:27","date_gmt":"2010-06-03T22:28:27","guid":{"rendered":"https:\/\/blogs.mentor.com\/verificationhorizons\/?p=1368"},"modified":"2026-03-27T08:44:33","modified_gmt":"2026-03-27T12:44:33","slug":"ovmuvm-at-dac-2010","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/2010\/06\/03\/ovmuvm-at-dac-2010\/","title":{"rendered":"OVM\/UVM at DAC 2010"},"content":{"rendered":"

Visit Booth 1350 \u2013 The hub of OVM\/UVM Activity at DAC<\/h3>\n

\"OVM_Logo\"<\/a>The OVM World<\/a> booth at the Design Automation Conference<\/a> (#1350<\/a>) will feature user and partner presentations on OVM<\/a>\/UVM<\/a>, a live discussion by prominent verification experts and a Tuesday cocktail reception from
\n4:30 p.m. to 6:00 p.m.<\/p>\n

\"UVM_Logo\"<\/a>The Open Verification Methodology (OVM) is the industry’s open and\u00a0 interoperable solution, guaranteed to run on multiple simulators, supporting multiple design languages, and is the basis for the Accellera UVM standard. The OVM enables scalability and reuse, fostering a vibrant verification ecosystem. OVMworld.org<\/a> is the one-stop site for the OVM open-source library, documentation, and community contributions.<\/p>\n

Featured half-hour presentations at the booth will include those listed below.\u00a0 In addition to the presenting company and presentation title, full presentation abstracts can be found at http:\/\/www.ovmworld.org\/tradeshows.php<\/a>.<\/p>\n

Monday (June 14th)<\/strong><\/span><\/span><\/p>\n\n\n\n\n\n\n\n\n\n
\n

10 a.m.<\/p>\n<\/td>\n

<\/td>\nSilicon Interfaces<\/strong><\/a>
\nOVM-based Verification Methodology VIP permits Silicon Interfaces to release Gigabit Ethernet MAC to industry with zero defect guarantee<\/td>\n<\/tr>\n
\n

11 a.m.<\/p>\n<\/td>\n

<\/td>\nAccellera<\/strong><\/a>
\nVIP Technical Subcommittee Update<\/td>\n<\/tr>\n
\n

1 p.m.<\/p>\n<\/td>\n

<\/td>\nVerilab<\/strong><\/a>
\nSimulation-Based FlexRay\u2122 Conformance Testing \u2013 an OVM success story<\/td>\n<\/tr>\n
\n

2 p.m.<\/p>\n<\/td>\n

<\/td>\nAMIQ<\/strong><\/a>
\nOVM Support in DVT<\/td>\n<\/tr>\n
\n

3 p.m.<\/p>\n<\/td>\n

<\/td>\nMentor Graphics & Cadence<\/strong>
\nOVM and UVM Update<\/td>\n<\/tr>\n
\n

4 p.m.<\/p>\n<\/td>\n

<\/td>\nNsys<\/strong><\/a>
\nSuperSpeed your USB 3.0 Verification with OVM based nSys Verification IP<\/td>\n<\/tr>\n
\n

5 p.m.<\/p>\n<\/td>\n

<\/td>\nDuolog<\/strong><\/a>
\nOVM\/UVM from a single spec<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Tuesday (June 15th)<\/strong><\/span><\/p>\n\n\n\n\n\n\n\n\n\n
\n

9 a.m.<\/p>\n<\/td>\n

<\/td>\nAldec<\/strong><\/a>
\nOVM\/UVM for FPGAs: The End of Burn and Churn?<\/td>\n<\/tr>\n
\n

10 a.m.<\/p>\n<\/td>\n

<\/td>\nSunburst Design<\/strong><\/a>
\nVirtual Interface Techniques for OVM<\/td>\n<\/tr>\n
\n

1 p.m.<\/p>\n<\/td>\n

<\/td>\nXilinx<\/strong><\/a>
\nBeyond a common base class library: reduce work by reusing OVM agents on common interfaces<\/td>\n<\/tr>\n
\n

2 p.m.<\/p>\n<\/td>\n

<\/td>\nDoulos<\/strong><\/a>
\nThe Communication and Customization Mechanisms in OVM and UVM<\/td>\n<\/tr>\n
\n

3 p.m.<\/p>\n<\/td>\n

<\/td>\nMentor Graphics & Cadence<\/strong>
\nOVM and UVM Update<\/td>\n<\/tr>\n
\n

4 p.m.<\/p>\n<\/td>\n

<\/td>\nMethodology Experts Discussion<\/a><\/td>\n<\/tr>\n
\n

5 p.m.<\/p>\n<\/td>\n

<\/td>\nCocktail Networking Event<\/strong><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Wednesday (June 16th)<\/strong><\/span><\/p>\n\n\n\n\n\n\n\n\n\n
9 a.m.<\/td>\n<\/td>\nDenali <\/strong><\/a>
\nDenali’s PureSpec: OVM-compatible VIP for bus and I\/O protocols<\/td>\n<\/tr>\n
10 a.m.<\/td>\n<\/td>\nSibridge<\/strong><\/a>
\nSuccessful OVM deployment<\/td>\n<\/tr>\n
11 a.m.<\/td>\n<\/td>\nAgnisys<\/strong><\/a>
\nAgile methods for OVM<\/td>\n<\/tr>\n
2 p.m.<\/td>\n<\/td>\nTSMC<\/strong><\/a>
\nESL to RTL Verification – Progressive Refinement and Reuse Paradigm.
\nTSMC Open Innovation Platform.<\/td>\n<\/tr>\n
3 p.m.<\/td>\n<\/td>\nMentor Graphics & Cadence<\/strong>
\nOVM and UVM Update<\/td>\n<\/tr>\n
4 p.m.<\/td>\n<\/td>\nAgnisys<\/strong><\/a>
\nAutomatic Generation of OVM Registers<\/td>\n<\/tr>\n
5 p.m.<\/td>\n<\/td>\nDuolog<\/strong><\/a>
\nGNAT<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Visit Booth 1350 \u2013 The hub of OVM\/UVM Activity at DAC The OVM World booth at the Design Automation Conference…<\/p>\n","protected":false},"author":71541,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[326,409,430,480,623,625,732,771,787,819,853],"industry":[],"product":[],"coauthors":[],"class_list":["post-1368","post","type-post","status-publish","format-standard","hentry","category-news","tag-accellera","tag-dac","tag-design-automation-conference","tag-flexray","tag-ovm","tag-ovmworld","tag-standards","tag-tsmc","tag-uvm","tag-verification","tag-xilinx"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/1368","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/users\/71541"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/comments?post=1368"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/1368\/revisions"}],"predecessor-version":[{"id":14652,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/posts\/1368\/revisions\/14652"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/media?parent=1368"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/categories?post=1368"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/tags?post=1368"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/industry?post=1368"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/product?post=1368"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/verificationhorizons\/wp-json\/wp\/v2\/coauthors?post=1368"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}