{"id":799,"date":"2021-12-06T10:59:49","date_gmt":"2021-12-06T15:59:49","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/valor\/?p=799"},"modified":"2026-03-26T13:32:31","modified_gmt":"2026-03-26T17:32:31","slug":"reduce-npi-profitability-risks-with-a-testing-based-approach","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/valor\/2021\/12\/06\/reduce-npi-profitability-risks-with-a-testing-based-approach\/","title":{"rendered":"Reduce NPI profitability risks with a testing-based approach"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">Blog #4 in a 12-part series covering the Digital Twin Best Practices in Electronics Manufacturing mini-webinar series by Jay Gorajia<\/h2>\n\n\n\n<p>When it comes to profitability in the electronics manufacturing sector, we talk a lot about mitigating risks by performing design verification and discovering flaws during the board design phase. It\u2019s clear that errors become costlier to fix as the project progresses. Can the same be said about errors in the test infrastructure of PCBs?<\/p>\n\n\n\n<p>If you are an experienced PCB designer, you\u2019ve surely been surprised by a net lacking test coverage, or by a test point that is blocked by an adjacent component, preventing access. Flaws such as these \u2013 which affect the manufacturability of your design \u2013 are usually identified by a test engineer during the <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/xpedition-enterprise\/test-analysis\/\" target=\"_blank\" rel=\"noreferrer noopener\">Design for Test (DFT) analysis<\/a>, which typically occurs late in the layout process, making the flaws costly to remediate. In addition, the analysis is manual and doesn\u2019t scale well.<\/p>\n\n\n\n<p>Wouldn\u2019t it be more efficient if DFT could be analyzed by anyone in the design flow \u2013 as early as in the schematic capture or design phases \u2013 by putting advanced test strategy tools in the hands of designers? &nbsp;<a href=\"https:\/\/iconnect007.com\/index.php\/my-i-connect007\/webinars\/implementing-digital-twin#session_4\" target=\"_blank\" rel=\"noreferrer noopener\">In the fourth session<\/a>&nbsp;of our series of 12 mini-webinars on&nbsp;<a href=\"https:\/\/blogs.sw.siemens.com\/valor\/2021\/11\/02\/the-secret-to-profitable-electronics-design-on-demand-webinar-series\/\" target=\"_blank\" rel=\"noreferrer noopener\"><em>Implementing \u201cDigital Twin\u201d Best Practices From Design Through Manufacturing<\/em><\/a>, we focus on on <strong>design verification from a testing point of view<\/strong>.<\/p>\n\n\n\n<p>By improving the testability of PCBs early in the design process, we save money by avoiding scenarios like the one mentioned above, and drastically reduce the number of required re-spins. In this way, we can further implement the digital-twin strategy that \u201cleft-shifts\u201d crucial processes and decisions, and help organizations get it right the first time.<\/p>\n\n\n\n<p>In the webinar, we also introduce <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/xpedition-enterprise\/test-analysis\/\" target=\"_blank\" rel=\"noreferrer noopener\">Valor\u00ae DFT<\/a> \u2013 Siemens\u2019 powerful and flexible design-for-test tool that can be leveraged by engineers across the PCB design flow.<\/p>\n\n\n\n<p>Main takeaways from the session:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>How Valor DFT reduces risks to profitability by implementing test strategies early in the design process \u2013 reducing repair costs and eliminating scrap<\/li><li>How to use Valor DFT to optimize test coverage of the board<\/li><li>How Valor DFT uses DPMO (Defects Per Million Opportunities) ratings to determine the testing requirements of each component<\/li><li>How to use Valor DFT check the alignment of the test strategy with the defect spectrum<\/li><\/ul>\n\n\n\n<p><a href=\"https:\/\/iconnect007.com\/index.php\/my-i-connect007\/webinars\/implementing-digital-twin#session_4\" target=\"_blank\" rel=\"noreferrer noopener\">Watch the webinar on-demand now!<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Blog #4 in a 12-part series covering the Digital Twin Best Practices in Electronics Manufacturing mini-webinar series by Jay Gorajia&#8230;<\/p>\n","protected":false},"author":11828,"featured_media":800,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[417,418,57,58,416],"industry":[357,358,356],"product":[260],"coauthors":[396],"class_list":["post-799","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-dfm","tag-dft","tag-electronics-manufacturing","tag-pcb-assembly","tag-pcb-design","industry-consumer-industrial-electronics","industry-electronic-manufacturing-services","industry-electronics-semiconductors","product-valor-dft"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2021\/12\/PCB-testing.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/799","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/users\/11828"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/comments?post=799"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/799\/revisions"}],"predecessor-version":[{"id":984,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/799\/revisions\/984"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media\/800"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media?parent=799"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/categories?post=799"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/tags?post=799"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/industry?post=799"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/product?post=799"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/coauthors?post=799"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}