{"id":438,"date":"2021-02-01T08:19:32","date_gmt":"2021-02-01T13:19:32","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/valor\/?p=438"},"modified":"2026-03-26T13:30:38","modified_gmt":"2026-03-26T17:30:38","slug":"opcenter-intelligence-electronics-a-powerful-solution-for-big-data-analytics","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/valor\/2021\/02\/01\/opcenter-intelligence-electronics-a-powerful-solution-for-big-data-analytics\/","title":{"rendered":"Opcenter Intelligence Electronics: A powerful solution for big data analytics"},"content":{"rendered":"\n<p>Do you feel like you\u2019re drowning in data? <\/p>\n\n\n\n<p>You\u2019re not alone\u2014PCB manufacturers today are required to maintain a full account of every product\u2019s history for compliance and traceability purposes, <a href=\"https:\/\/blogs.sw.siemens.com\/valor\/2020\/11\/30\/webinar-on-demand-data-driven-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">generating more data than ever before<\/a>. Simply storing and securing the enormous quantities of data can be challenging, especially for manufacturers with more than one site. Effectively utilizing the data is even more difficult\u2014so it\u2019s not surprising that research has shown that only a small portion of data generated by electronics manufacturing operations is collected and even less is analyzed. It\u2019s almost never utilized in real time to prevent production problems before they occur or to improve material management efficiency.<\/p>\n\n\n\n<p>This gap is particularly problematic when it comes to high-mix, low-volume (HMLV) production, where each new product introduction requires huge time and resources to achieve high yield and efficiency.<\/p>\n\n\n\n<p><a href=\"http:\/\/bit.ly\/OpcenterIntelligenceElectronicsCatalogue\" target=\"_blank\" rel=\"noreferrer noopener\">This eBook<\/a> will walk you through everything you need to know to leverage your data and optimize operations using Siemen\u2019s <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/manufacturing-operations\/manufacturing-analytics-pcb-assembly.html\" target=\"_blank\" rel=\"noreferrer noopener\">Opcenter Intelligence Electronics<\/a>. You\u2019ll learn how out-of-the-box reports help identify and prevent problems before they occur and improve design-to-manufacturing efficiency by detecting factors that impact yield.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>A simple way to transform data from a burden into an asset<\/strong><\/h2>\n\n\n\n<p><a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/products\/manufacturing-operations\/manufacturing-analytics-pcb-assembly.html\" target=\"_blank\" rel=\"noreferrer noopener\">Opcenter Intelligence Electronics<\/a> can be integrated with existing product lifecycle management (PLM), enterprise resource planning (ERP) and manufacturing operations management (MOM) software, making it easy to measure and analyze how resources are spent. It also provides a comprehensive solution for big-data, high-availability storage.<\/p>\n\n\n\n<p><a href=\"http:\/\/bit.ly\/OpcenterIntelligenceElectronicsCatalogue\" target=\"_blank\" rel=\"noreferrer noopener\">Download the eBook<\/a> and get started on a new, smart-data-driven future.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Do you feel like you\u2019re drowning in data? You\u2019re not alone\u2014PCB manufacturers today are required to maintain a full account&#8230;<\/p>\n","protected":false},"author":69244,"featured_media":439,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[38,40],"tags":[57,15,51,60,58],"industry":[],"product":[162],"coauthors":[],"class_list":["post-438","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-ebook","category-learning-resources","tag-electronics-manufacturing","tag-industry-4-0","tag-iot","tag-manufacturing-analytics","tag-pcb-assembly","product-opcenter-execution-electronics"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2021\/02\/BI_image-scaled-e1612183922128.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/438","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/users\/69244"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/comments?post=438"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/438\/revisions"}],"predecessor-version":[{"id":441,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/438\/revisions\/441"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media\/439"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media?parent=438"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/categories?post=438"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/tags?post=438"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/industry?post=438"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/product?post=438"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/coauthors?post=438"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}