{"id":1520,"date":"2026-03-31T09:31:51","date_gmt":"2026-03-31T13:31:51","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/valor\/?p=1520"},"modified":"2026-03-31T09:36:22","modified_gmt":"2026-03-31T13:36:22","slug":"technology-meets-quality-from-pcb-design-to-electronics-manufacturing-excellence","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/valor\/2026\/03\/31\/technology-meets-quality-from-pcb-design-to-electronics-manufacturing-excellence\/","title":{"rendered":"Technology meets quality: from PCB design to electronics manufacturing excellence"},"content":{"rendered":"\n<p><strong>Join <\/strong><a href=\"https:\/\/www.siemens.com\/en-us\/products\/tecnomatix\/process-preparation-software\/\" target=\"_blank\" rel=\"noopener\"><strong>Siemens<\/strong><\/a><strong> and <\/strong><a href=\"https:\/\/www.goepel.com\/en\" target=\"_blank\" rel=\"noopener\"><strong>G\u00d6PEL electronic<\/strong><\/a><strong> at <\/strong><a href=\"https:\/\/www.testconvention.com\/\" target=\"_blank\" rel=\"noopener\"><strong>Test Convention 2026<\/strong><\/a><\/p>\n\n\n\n<p>In today\u2019s electronics manufacturing landscape, quality and efficiency are no longer achieved through isolated tools or disconnected processes. Real success depends on how well <strong>PCB design<\/strong>, <strong>bill of materials (BOM)<\/strong>, <strong>manufacturing process planning<\/strong>, and <strong>inspection and test<\/strong> are connected across the entire <strong>design\u2011to\u2011production<\/strong> flow.<\/p>\n\n\n\n<p>This is exactly the focus of <a href=\"https:\/\/www.testconvention.com\/\" target=\"_blank\" rel=\"noopener\"><strong>Test Convention 2026<\/strong><\/a>, organized by <a href=\"https:\/\/www.goepel.com\/en\" target=\"_blank\" rel=\"noopener\"><strong>G\u00d6PEL electronic<\/strong><\/a> with active participation from <strong>Siemens<\/strong>, taking place on <strong>April 22\u201323, 2026, in Jena, Germany<\/strong>.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"240\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2026\/03\/2026_Test-Convention_Mailing_600x240-px.jpg\" alt=\"Banner promoting the Test Convention for Electronics Manufacturers\" class=\"wp-image-1522\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2026\/03\/2026_Test-Convention_Mailing_600x240-px.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2026\/03\/2026_Test-Convention_Mailing_600x240-px-300x120.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/figure>\n\n\n\n<p>Under the theme <strong>\u201cTechnology Meets Quality,\u201d<\/strong> the event brings together experts in <strong>printed circuit board design<\/strong>, <strong>process engineering<\/strong>, and <strong>electronics manufacturing<\/strong> to explore how modern test, inspection, and digital manufacturing approaches improve real production outcomes.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Why Test Convention matters<\/strong><\/h3>\n\n\n\n<p>Test Convention has become a key industry event for professionals responsible for turning design intent into reliable, high\u2011quality products. The agenda focuses on practical, production\u2011driven challenges, including:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Improving <strong>manufacturing efficiency<\/strong> by connecting design, process planning, and production<\/li>\n\n\n\n<li>Reducing rework and scrap through better <strong>manufacturing process planning<\/strong><\/li>\n\n\n\n<li>Strengthening quality with advanced inspection and test strategies<\/li>\n<\/ul>\n\n\n\n<p>Rather than abstract theory, the event emphasizes <strong>real use cases<\/strong>, <strong>live demonstrations<\/strong>, and <strong>hands\u2011on experience<\/strong>.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Hands\u2011On Insight: from design to production<\/strong><\/h3>\n\n\n\n<p>A core strength of Test Convention is its strong link between design and manufacturing execution. Participants will experience hands\u2011on workshops hosted directly at the G\u00d6PEL electronic factory, covering topics such as <strong>JTAG \/ Boundary Scan<\/strong>, <strong>automated optical inspection (AOI \/ AXI)<\/strong>, data integration, and inspection optimization.<\/p>\n\n\n\n<p>Live demonstrations will show how inspection and test technologies support modern electronics manufacturing processes, while practical discussions address how to shorten the path from <strong>PCB design to production<\/strong>.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Digital Twin and process optimization<\/strong><\/h3>\n\n\n\n<p>A recurring theme throughout the event is the growing role of <strong>digital twin<\/strong> concepts in electronics manufacturing. By combining production data, inspection results, and process knowledge, manufacturers can simulate and optimize the <strong>manufacturing process<\/strong> before physical production, improve first\u2011pass yield, and increase transparency across design, process planning, and execution.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Join Us in Jena<\/strong><\/h3>\n\n\n\n<p>If your goal is to improve quality, efficiency, and collaboration across electronics manufacturing, from <strong>PCB design<\/strong> and <strong>BOM management<\/strong> to <strong>manufacturing process execution<\/strong>, <strong>Test Convention 2026<\/strong> offers two days of focused learning, practical insight, and industry exchange.<\/p>\n\n\n\n<p>\ud83d\udc49 Learn more and register at <a href=\"https:\/\/www.testconvention.com\/\" target=\"_blank\" rel=\"noreferrer noopener\"><strong>www.testconvention.com<\/strong><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Join Siemens and G\u00d6PEL electronic at Test Convention 2026 In today\u2019s electronics manufacturing landscape, quality and efficiency are no longer&#8230;<\/p>\n","protected":false},"author":69603,"featured_media":1524,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,39,2],"tags":[],"industry":[],"product":[],"coauthors":[616],"class_list":["post-1520","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-events","category-featured"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/22\/2026\/03\/2026_Test-Convention_PR_1280x720-px.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/1520","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/users\/69603"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/comments?post=1520"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/1520\/revisions"}],"predecessor-version":[{"id":1526,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/posts\/1520\/revisions\/1526"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media\/1524"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/media?parent=1520"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/categories?post=1520"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/tags?post=1520"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/industry?post=1520"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/product?post=1520"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/valor\/wp-json\/wp\/v2\/coauthors?post=1520"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}