Strengthening PCB Solder Connections
To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.
Stencil design considerations during library cell design
Library cell design seems to be an easy part of the entire design process, but in reality, it can be a complicated part of this process, as it involves many different aspects to consider. It should not only comply with the electrical needs, but also needs to meet manufacturing requirements. Solder paste printing is one of the manufacturing processes that may need considerations during your library cell creation. To be more straightforward, the stencil design is something need to be considered during library cell design.
Advanced DFM Constraints management in ADM (Analysis Definition Manager)- Valor NPI 2211
The Analysis Definition Manager (ADM), introduced in Valor NPI 10.0, is a constraints management tool for creating and maintaining sets of Design for Manufacturing DFM rules to be used during the analysis in Valor NPI.