![\"ICBDP_1000.jpg\"](\"http:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2019\/09\/ICBDP_1000-1.jpg\" "\\"ICBDP_1000.jpg\\"")
<\/span><\/p>\nAssuming that the solder joint stress does not surpass ultimate strength and fail on the first power up and vibration, it will take time for the cracks to form and propagate. The first question is, are the stresses below the endurance limit? Can we be sure it won\u2019t crack or fatigue? It the stress is above the endurance limit, it then is a matter of time until the crack occurs, if so how long will it take to fail?<\/p>\n
Given enough time, most everything will degrade. However, if a crack takes 100 years to result in a failure, that can be considered acceptable. This process is performed in all engineering industries.<\/p>\n
Also, many electronic system components and materials have not been investigated to this level of detail. Fatigue assessments don\u2019t exist to quantify life expectancy, and are further complicated by the solder being reformulated to remove or reduce levels of lead due to regulatory pressures and requirements. Material fatigue characterization often lags in such situations, and inhibits accurate forecasts of life expectancy. This is a typical issue in the industry as fatigue testing of new materials takes time and considerable costs.<\/p>\n
In response, the industry has developed PCB failure analysis techniques and utilized general risk factors assessments and empirical knowledge to guide development. While they are useful, it often results in overdesigned products to achieve design and safety margins. As the digitalization<\/a> and simulation capabilities for electronic systems improve as required by the next generation of vehicle development, the industry will demand these new material properties \u2013 there will be no choice.<\/p>\n The future of AV\/EV\/ADAS is exciting, but the engineering challenges are ever escalating. The digitalization of PCB<\/a> failure analysis will play a key role now that the safety and robustness of electronic systems and their circuit boards is front and center. It is no longer a matter of customer frustration, but of customer safety. The glitchy consumer electronics functionality of the past cannot be allowed to continue. As was determined during the Apollo 13 mission \u2013 failure is not an option.<\/p>\n