{"id":2875,"date":"2020-01-08T20:37:27","date_gmt":"2020-01-09T01:37:27","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/?p=2875"},"modified":"2026-03-26T12:02:14","modified_gmt":"2026-03-26T16:02:14","slug":"harnessing-the-power-of-ai","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/harnessing-the-power-of-ai\/","title":{"rendered":"Where today meets tomorrow: harnessing the power of AI (part I)"},"content":{"rendered":"\n<p>Semiconductors are at the core of every major disruption and innovation. Today, with an unprecedented level of investment, we are witnessing artificial intelligence (AI) become an engine for the growth of the semiconductor industry.<\/p>\n\n\n\n<p>Manufacturing\ncompanies as well as software companies are embracing integrated circuit (IC)\ndesign as a new core competency. These players are driving the complete\nvirtualization of the product development and manufacturing process \u2014 building the most comprehensive <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/our-story\/glossary\/digital-twin\/24465\" target=\"_blank\" rel=\"noopener\">digital twin<\/a>. They\u2019re also\nin the best position to solve the big bottleneck of the practical application\nof AI: a sufficient amount of relevant and complete training data and a product\ndevelopment platform that allows to design and verify functionality and\nreal-time performance of advanced, AI-driven features.<\/p>\n\n\n\n<p><strong>AI \u2013 a growth engine for semiconductors<\/strong><\/p>\n\n\n\n<p>It is mind-boggling\nto see how fast the semiconductor industry is advancing and how much investment\nand research goes into AI and machine learning (ML). Given the enormous\ninvestment both at the corporate level and in venture capital, there is little\ndoubt in my mind that AI will be at the core of the next industrial revolution\njust as much as in the next \u201ckiller products\u201d.<\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"560\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/notifier-app-seidel-180910-eci_medium.jpeg\" alt=\"\" class=\"wp-image-2868\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/notifier-app-seidel-180910-eci_medium.jpeg 1000w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/notifier-app-seidel-180910-eci_medium-600x336.jpeg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/notifier-app-seidel-180910-eci_medium-768x430.jpeg 768w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/figure><\/div>\n\n\n\n<p>It has been this way\nfor the past 40 years \u2013 whether it\u2019s the Palm Pilot, the smartphone or the\nsmart watch \u2014 they all started with limited capabilities and were fairly\nclunky. Thanks to Moore\u2019s law, the next generation is twice as beautiful, sleek\nand powerful, and makes us want to open our wallets.<\/p>\n\n\n\n<p>In 2018, venture capital funding of fabless semiconductor\ncompanies in AI exceeded the level for the entire industry in 2002. Like a\nseismic force, companies are creating domain-specific AI and deep learning\ncapabilities. By an informal analysis, there are around 40 companies\nspecializing on vision applications and about the same number focused on\ncloud\/HPC AI and AI applications on the edge, respectively. <\/p>\n\n\n\n<div class=\"wp-block-image\"><figure class=\"aligncenter size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"450\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/Companies-creating-domain-specific-AI-1.jpg\" alt=\"\" class=\"wp-image-2877\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/Companies-creating-domain-specific-AI-1.jpg 800w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/Companies-creating-domain-specific-AI-1-600x338.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/Companies-creating-domain-specific-AI-1-768x432.jpg 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/figure><\/div>\n\n\n\n<p>There\u2019s reason to\nassume that we will continue to see more and more powerful, power-efficient and\nhighly specialized chips for AI and ML applications, enabling more and more\naccurate applications with amazing real-time responsiveness.<\/p>\n\n\n\n<p><strong>The semiconductor playing field is shifting <\/strong><\/p>\n\n\n\n<p>At the same time,\ncompanies not known as \u201cchip designers\u201d or manufacturers are increasingly entering\nthe scene: not only Google, Facebook, and Amazon, but also Ford, Lockheed\nMartin, Boeing and Northrup Grumman, just to name a few.<\/p>\n\n\n\n<p>The simple reason for this focus is the potential for\ndifferentiation. For any manufacturer of a consumer or industrial product,\nhaving the fastest, most robust and most power-efficient hardware can give them\nseveral years of lead. For example: advanced driver assistance systems (ADAS),\nindustrial vision applications, autonomous control and other disciplines.<\/p>\n\n\n\n<p>Especially when it\ncomes to advanced applications and AI, systems companies may have an advantage\nto overcome one of the big bottlenecks: the right data. <\/p>\n\n\n\n<p><strong>Availability of data is still a limiting factor for many\nAI applications<\/strong><\/p>\n\n\n\n<p>Oftentimes, we are\nled to believe there is an abundance (if not a deluge) of data. However, there is\nquite a number of highly-relevant industrial applications of AI and ML where\nthat\u2019s not the case at all.<\/p>\n\n\n\n<p>Take autonomous\ndriving as an example.<\/p>\n\n\n\n<p>Akio Toyoda, <a href=\"https:\/\/www.forbes.com\/sites\/alanohnsman\/2016\/10\/03\/toyotas-robot-car-line-in-the-sand-8-8-billion-test-miles-to-ensure-safety\/#7f02eaeb16f0\" target=\"_blank\" rel=\"noopener\">Toyota\u2019s<\/a>\npresident and grandson of the founder, has stated that to accomplish safety in\nautonomous vehicles, it will take an estimated 8.8 billion miles of testing,\nincluding simulation to complete verification of its driving functionality. To\ndo this level of road testing requires driving to the moon and back 16,000\ntimes.<\/p>\n\n\n\n<p>The same is true for\nmany scenarios of predictive maintenance. If a component breaks after an\naverage lifetime of ten years, it takes a long time to gather enough data to\npredict its failure from the real world.<\/p>\n\n\n\n<p><strong>The digital twin: how to overcome the <em>data bottleneck<\/em><\/strong><\/p>\n\n\n\n<p>Automakers, machine\nbuilders, aerospace and defense companies, and consumer product manufacturers\nhave been virtualizing product development and manufacturing for many years.\nThey have pursued the vision of a comprehensive digital twin of the product,\nits manufacturing process, and, with the rise of IoT, its operation.<\/p>\n\n\n\n<p>As products grow\nmore and more complex, a digital twin that can accurately represent the\nphysical and mechanical product, the software driving its electronic\ncomponents, and even the behavior of the IC processing the input from a multitude\nof sensors is becoming a necessity. It\u2019s the tool that engineers will need to use\nto develop and verify tomorrow\u2019s products. However, it is also capable to\ncreate the immensely large datasets needed to build and validate AI\/ML-driven\nfeatures that are robust enough for the real world. <\/p>\n\n\n\n<p><em>This concludes part 1 of\na summary of what I talked about at <a href=\"https:\/\/embeddedandvlsidesignconference.org\/\" target=\"_blank\" rel=\"noopener\">VLSID<\/a><\/em> on January 7,\n2020<em>. In my next blog post, I\u2019ll discuss\nhow the digital twin of the product becomes part of the vision of a mobility\ndigital enterprise and how AI will factor in to creating integrated mobility\nsolutions that span all the way from the chip to the city.<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Semiconductors are at the core of every major disruption and innovation. Today, with an unprecedented level of investment, we are&#8230;<\/p>\n","protected":false},"author":14392,"featured_media":2873,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[12,11,36],"industry":[134],"product":[],"coauthors":[],"class_list":["post-2875","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-artificial-intelligence","tag-digital-twin","tag-electronics-and-semiconductor","industry-electronics-semiconductors"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/19\/2020\/01\/blue-circuit-board-with-binary-numbers_original.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/posts\/2875","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/users\/14392"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/comments?post=2875"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/posts\/2875\/revisions"}],"predecessor-version":[{"id":2878,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/posts\/2875\/revisions\/2878"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/media\/2873"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/media?parent=2875"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/categories?post=2875"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/tags?post=2875"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/industry?post=2875"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/product?post=2875"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/thought-leadership\/wp-json\/wp\/v2\/coauthors?post=2875"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}