{"id":938,"date":"2020-11-11T13:29:15","date_gmt":"2020-11-11T18:29:15","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/tessent\/?p=938"},"modified":"2026-03-26T16:06:09","modified_gmt":"2026-03-26T20:06:09","slug":"tessents-itc-2020-wrap-up","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2020\/11\/11\/tessents-itc-2020-wrap-up\/","title":{"rendered":"Tessent\u2019s ITC 2020 wrap-up"},"content":{"rendered":"\n<p>The International Test Conference carried on this year as a virtual event. It\u2019s a difficult format to make work, but the content was top-notch as ever.<\/p>\n\n\n\n<p>The Tessent group made a significant product announcement\u2014Streaming Scan Network (SSN), which decouples core-level DFT configuration and chip-level DFT resources. SSN supports all the existing features of TestKompress\u2122, such as defect-oriented test and critical area based pattern optimization.<\/p>\n\n\n\n<p>In addition to a presentation in the virtual SSN booth, and presentations from Intel and Qualcomm during the Diamond Supporter Event, Tessent and Intel presented a technical paper \u201cStreaming Scan Network (SSN): An Efficient Packetized Data Network for Testing of Complex SoCs.\u201d The results of Intel\u2019s experiments with SSN show significant value compared to their current technology (hier mux and their&nbsp; internal data delivery method, STF). Here\u2019s what they saw with SSN:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Reduced the test data volume by 36% and 43% (mux and STF)<\/li><li>Reduced test cycles by 16% and 43%<\/li><li>10x \u2013 20x faster with SSN compared to STF<\/li><\/ul>\n\n\n\n<p>SSN eliminates the tradeoffs between either an effective, streamlined implementation flow, or minimized test cost. SSN is a no-compromise approach to DFT leveraging packetized delivery of scan test data. It was developed over three years of partnerships and validated in silicon with 6 tapeouts in 2020.<\/p>\n\n\n\n<p><a href=\"https:\/\/go.mentor.com\/5fe6M\/?cmpid=11832\" target=\"_blank\" rel=\"noreferrer noopener\">Read more in the whitepaper.<\/a> <\/p>\n\n\n\n<p>While Streaming Scan Network was the star of our show this year, we did present 13 papers, 6 posters, 2 tutorials, and 3 ART workshop papers.<\/p>\n\n\n\n<p>In addition, our own analog\/mixed-signal test guru, Stephen Sunter, won the best paper award for his 2019 ITC paper \u201cEfficient Analog Defect Simulation.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The International Test Conference carried on this year as a virtual event. It\u2019s a difficult format to make work, but&#8230;<\/p>\n","protected":false},"author":71644,"featured_media":939,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5],"tags":[321,370,372,373],"industry":[],"product":[269],"coauthors":[],"class_list":["post-938","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","tag-dft","tag-embedded-analytics","tag-silicon-lifecycle","tag-streaming-scan-network","product-tessent"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2020\/11\/itc-wp-tn.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/938","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/71644"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=938"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/938\/revisions"}],"predecessor-version":[{"id":940,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/938\/revisions\/940"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media\/939"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=938"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=938"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=938"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=938"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=938"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=938"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}