{"id":387,"date":"2017-03-24T10:46:13","date_gmt":"2017-03-24T17:46:13","guid":{"rendered":"http:\/\/blogs.mentor.com\/tessent\/?p=387"},"modified":"2026-03-26T16:04:13","modified_gmt":"2026-03-26T20:04:13","slug":"u2u-2017-see-you-there","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2017\/03\/24\/u2u-2017-see-you-there\/","title":{"rendered":"U2U 2017 &#8211; See you there!"},"content":{"rendered":"<p><em>Mentor\u2019s user group event this year is located at the Santa Clara Marriott on April 4, 2017. Here&#8217;s what you won&#8217;t want to miss&#8230;<\/em><\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2017\/03\/2017-U2U-Logo-White-on-Redtag-1920.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-391\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2017\/03\/2017-U2U-Logo-White-on-Redtag-1920-520x293.png\" alt=\"\" width=\"520\" height=\"293\" \/><\/a><\/p>\n<p><!--more--><\/p>\n<p>This free event is a great chance to network and learn about real-world experiences using Mentor tools. The keynotes this year are Chris Collins talking about the future internet of cars, and <em><strong>Mentor\u2019s own Walden Rhines<\/strong> <\/em>on predicting the next wave of semiconductor growth.<\/p>\n<p>Among the technical sessions, Tessent DFT and yield offers four presentations by leading semiconductor customers:<\/p>\n<ul>\n<li>Jonathan Phelps of ON Semiconductor presents \u201cA Case Study on IJTAG for Existing IPs, or The Missing Manual for Teaching Old Dogs New Tricks,\u201d in which describes how to improve efficiency and ease of chip-level integration for an existing IP BIST.<\/li>\n<li>Gvorg Torjyan of Marvell presents \u201cHierarchical SoC Design Flow with DFT and IJTAG Network Implementation at RTL Stage,\u201d which covers his experience implementing DFT at the RTL level and the impact on the overall design flow.<\/li>\n<li>Cypress presents \u201cBench-top Environment for Accelerated Bring-up of ATPG\/EDT Patterns,\u201d describing a new Tessent SiliconInsight capability for bench-top test, diagnosis and characterization of digital ICs that saves time and cost.<\/li>\n<li>Qualcomm presents \u201cHigh Quality Production Test with a Low Pin Count Interface,\u201d which describes the benefits and tradeoffs of three types of low pin count test they explored in Tessent TestKompress.<\/li>\n<\/ul>\n<p>When not in a session, you can head over to the U2U Exchange for information, product demos, and technical advice.<\/p>\n<p>As always, we invite you to wrap up the day comparing notes and socializing with your colleagues at the closing reception that features an open bar, snacks, and drawings for great prizes.<\/p>\n<p>Register<a href=\"http:\/\/user2user.mentor.com\/events\/user2user-silicon-valley-2017\/\" target=\"_blank\" rel=\"noopener\"> here\u00a0<\/a>for Mentor\u2019s User2User!<\/p>\n<p><a href=\"http:\/\/bit.ly\/1hf2bMq\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-61 size-full\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2015\/09\/LinkedIn-Button.jpg\" alt=\"\" width=\"300\" height=\"70\" \/><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Mentor\u2019s user group event this year is located at the Santa Clara Marriott on April 4, 2017. Here&#8217;s what you&#8230;<\/p>\n","protected":false},"author":71644,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[],"industry":[],"product":[],"coauthors":[],"class_list":["post-387","post","type-post","status-publish","format-standard","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/387","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/71644"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=387"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/387\/revisions"}],"predecessor-version":[{"id":2333,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/387\/revisions\/2333"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=387"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=387"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=387"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=387"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=387"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=387"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}