{"id":2159,"date":"2024-01-16T19:30:21","date_gmt":"2024-01-17T00:30:21","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/tessent\/?p=2159"},"modified":"2026-03-26T16:08:05","modified_gmt":"2026-03-26T20:08:05","slug":"leveraging-the-risc-v-efficient-trace-e-trace-standard","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2024\/01\/16\/leveraging-the-risc-v-efficient-trace-e-trace-standard\/","title":{"rendered":"Video: Leveraging the RISC-V efficient trace (E-Trace) standard"},"content":{"rendered":"\n<p class=\"has-medium-font-size\"><em>Understanding program behavior in complex systems is not easy. Understanding the behavior of complete systems is even more challenging. Get non-intrusive, full-speed and system-level visibility with E-Trace.<\/em><\/p>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<p>Processor trace gives developers access to critical insights and forensic capabilities to manage the risk of building embedded systems. Efficient Trace for RISC-V (E-Trace) was the topic of a well-attended presentation at the RISC-V Summit held on November 7-8 in Santa Clara, CA. Iain Roberston, Senior Director of hardware engineering in the Tessent group at Siemens EDA delivered \u201cLeveraging the RISC-V efficient trace (E-Trace) standard.\u201d His 17-minute presentation was recorded and is now available on-demand.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large is-resized\"><a href=\"https:\/\/resources.sw.siemens.com\/en-US\/video-leveraging-the-risc-v-efficient-trace-e-trace-standard\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"542\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot-1024x542.jpg\" alt=\"\" class=\"wp-image-2170\" style=\"width:840px;height:auto\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot-1024x542.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot-600x318.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot-768x407.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot-900x476.jpg 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-screenshot.jpg 1447w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/a><\/figure>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-constrained wp-block-group-is-layout-constrained\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n<\/div>\n<\/div><\/div>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<p>What you\u2019ll learn:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Trace basics, including ways in which trace is commonly implemented<\/li>\n\n\n\n<li>An overview of the RISC-V Efficient trace (E-Trace) standard<\/li>\n\n\n\n<li>How processor trace is used to improve embedded software and applications, including a case study of how Seagate used E-Trace<\/li>\n\n\n\n<li>Comparisons of different E-Trace solutions<\/li>\n<\/ul>\n\n\n\n<div class=\"wp-block-buttons is-layout-flex wp-block-buttons-is-layout-flex\">\n<div class=\"wp-block-button\"><a class=\"wp-block-button__link wp-element-button\" href=\"https:\/\/resources.sw.siemens.com\/en-US\/video-leveraging-the-risc-v-efficient-trace-e-trace-standard\" target=\"_blank\" rel=\"noreferrer noopener\">Watch now<\/a><\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\">\n<p>Processor trace is a common non-intrusive debugging technique which many development teams and customers expect as a minimum feature of any SoC deliverable. Trace captures, encodes and transmits off-chip a record of executed processor instructions, which software tools can use to reconstruct the exact execution sequence of a program. Embedded developers can then inspect the execution sequence to verify the RISC-V instruction set architecture (ISA), debug application code, profile the processor and explore code coverage.<\/p>\n\n\n\n<p>Representatives from Siemens led the RISC-V Debug and Trace Working Group and donated the trace algorithm to the RISC-V International community. Siemens now offers the market-leading RISC-V trace solution, The Tessent Enhanced Trace Encoder. <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic\/tessent\/embedded-analytics\/risc-v\/\" target=\"_blank\" rel=\"noopener\">Learn more about Tessen&#8217;t RISC-V solutions<\/a>.<\/p>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\">\n<figure class=\"wp-block-image size-medium\"><img loading=\"lazy\" decoding=\"async\" width=\"585\" height=\"600\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-585x600.jpg\" alt=\"Tessent RISC-V Enhanced Trace Encoder\" class=\"wp-image-2164\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-585x600.jpg 585w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-999x1024.jpg 999w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-768x788.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-1498x1536.jpg 1498w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-1997x2048.jpg 1997w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace-900x923.jpg 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V-trace.jpg 2004w\" sizes=\"auto, (max-width: 585px) 100vw, 585px\" \/><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:66.66%\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:33.33%\"><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Learn more about using the RISC-V efficient trace standard for non-intrusive, full-speed and system-level visibility.<\/p>\n","protected":false},"author":69877,"featured_media":2178,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,7],"tags":[756,370,736],"industry":[53],"product":[269,629],"coauthors":[719],"class_list":["post-2159","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-learning-resources","tag-e-trace","tag-embedded-analytics","tag-risc-v-trace","industry-electronics-semiconductors","product-tessent","product-tessent-embedded-analytics"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2024\/01\/RISC-V_Webinar_Promo_Banner_Photo.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2159","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/69877"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=2159"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2159\/revisions"}],"predecessor-version":[{"id":2179,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2159\/revisions\/2179"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media\/2178"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=2159"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=2159"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=2159"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=2159"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=2159"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=2159"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}