{"id":2027,"date":"2023-07-24T12:19:33","date_gmt":"2023-07-24T16:19:33","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/tessent\/?p=2027"},"modified":"2026-03-26T16:07:38","modified_gmt":"2026-03-26T20:07:38","slug":"video-intel-uses-tessent-ssn-for-ic-test-and-bring-up","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2023\/07\/24\/video-intel-uses-tessent-ssn-for-ic-test-and-bring-up\/","title":{"rendered":"Video: Intel uses Tessent SSN for IC test and bring-up"},"content":{"rendered":"\n<p>At the 2023 European User2User conference, Ofri Brenroth, DFT lead at Intel, describes their experience implementing Tessent Streaming Scan Network (SSN) on Intel\u2019s network and edge compute cloud connectivity devices. He gives an overview of SSN, described their motivations for adopting SSN, what advantages they saw, how they implemented SSN, and their silicon bring-up experience.<\/p>\n\n\n\n<p>The presentation was recorded and is now available for anyone to view.<\/p>\n\n\n\n<figure class=\"wp-block-embed is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe loading=\"lazy\" title=\"Presentation by Intel - Tessent SSN Silicon Bring up\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/hEH_A9q7P30?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>\n<\/div><\/figure>\n\n\n\n<p>Brenroth\u2019s group has very aggressive schedule and test cost goals, and wanted to see if Tessent SSN could reduce test time and cost without impacting their DFT and physical design flows. To implement the SSN for their full-chip architectures, Benroth\u2019s team worked closely with the physical designers and test engineers to meet all the requirements and limitations, from pre-silicon simulations to post-silicon debug and validation. To increase their confidence level on the first SSN implementation, they enabled a debug feature that let them observe some of the SSN scan signals at the ATE level.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Hear about Intel&#8217;s use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.<\/p>\n","protected":false},"author":69877,"featured_media":2028,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[7,1],"tags":[321,739,700],"industry":[],"product":[269,683],"coauthors":[719],"class_list":["post-2027","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-learning-resources","category-news","tag-dft","tag-silicon-bring-up","tag-ssn","product-tessent","product-tessent-test"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2023\/07\/u2u-EU-Intel-ssn.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2027","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/69877"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=2027"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2027\/revisions"}],"predecessor-version":[{"id":2031,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/2027\/revisions\/2031"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media\/2028"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=2027"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=2027"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=2027"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=2027"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=2027"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=2027"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}