{"id":1747,"date":"2022-10-22T12:28:10","date_gmt":"2022-10-22T16:28:10","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/tessent\/?p=1747"},"modified":"2026-03-26T16:06:56","modified_gmt":"2026-03-26T20:06:56","slug":"measure-heterogenous-soc-performance","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2022\/10\/22\/measure-heterogenous-soc-performance\/","title":{"rendered":"Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference"},"content":{"rendered":"\n

Register now<\/a> for Linley Fall Processor Conference, the prestigious autumnal gathering from the Linley Group. The session topics and speakers are chosen by Linley Group analysts so it\u2019s a great opportunity to meet up with technical experts and to learn about new trends and architectures in real-world applications. The topic of the Siemens presentation falls into the category of Silicon Lifecycle Management.<\/p>\n\n\n\n

When: <\/strong>November 1-2, 2022<\/p>\n\n\n\n

Where: <\/strong>Hyatt Regency Hotel, Santa Clara, CA
            + Virtual<\/p>\n\n\n\n

Why: <\/strong>To attend \u201cA new way of measuring heterogeneous SoC performance\u201d presented by Hanan Moller of Siemens, and probably some other presentations.<\/p>\n\n\n\n

\n
Register now<\/a><\/div>\n<\/div>\n\n\n\n

Measuring heterogenous SoC performance<\/h2>\n\n\n\n

Hanan Moller is in the Tessent group at Siemens Digital Industries Software. He\u2019ll talk at the Linley Conference to an issue facing many companies today \u2013 how to know the true performance of your modern SoC? Tradition debug and validation techniques are not always enough.<\/p>\n\n\n\n

This doesn\u2019t just mean the device performance for the end user, although that is part of it. Companies need to measure the performance of SoCs pre-silicon and post-silicon, and also get feedback from the field through the life of the device. That data needs to be fed back into development operations and design in a way that improves the product for the next product generation.<\/p>\n\n\n\n

\"Silicon<\/figure>\n\n\n\n

Some of the tools to make this a reality are available today, and other bits of this type of Silicon Lifecycle Management flow are still in the works. For example, we have IP that enables system-level (emulation style) visibility of real silicon. Hanan will cover that in his presentation.<\/p>\n\n\n\n

But wait. Is \u201cperformance\u201d the best term to use when thinking about the data you need from your SoC? Maybe how *performant* is the better question because it\u2019s not just speed, but also functional safety or security parameters that need to be monitored and measured. This level of system-level functional monitoring is becoming more important and Hanan will lead you through\u2014in exquisite detail\u2014an example system with embedded monitors.<\/p>\n\n\n\n

About the Linley Fall Processor Conference<\/strong><\/p>\n\n\n\n

Mobile, data-center, and embedded applications demand increasingly complex processors. To assist in the design of these processors, many companies have stepped up to offer IP cores, tools, and chiplets,\u201d said Joseph Byrne, conference chairperson. \u201cThe Linley Processor Conference Powered by TechInsights gathers leading semiconductor-industry vendors to deliver vetted presentations about their newest solutions. These talks, plus keynote speeches and Q&A panels, give attendees the critical information they need to select the best processor technology for their designs.<\/p>\n","protected":false},"excerpt":{"rendered":"

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT,
\nand server designs.<\/p>\n","protected":false},"author":71644,"featured_media":1774,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5],"tags":[370,385,390],"industry":[53],"product":[629],"coauthors":[375],"class_list":["post-1747","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","tag-embedded-analytics","tag-silicon-lifecycle-management","tag-soc","industry-electronics-semiconductors","product-tessent-embedded-analytics"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2022\/10\/Linley-hero2-scaled.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1747","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/71644"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=1747"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1747\/revisions"}],"predecessor-version":[{"id":1788,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1747\/revisions\/1788"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media\/1774"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=1747"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=1747"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=1747"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=1747"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=1747"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=1747"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}