{"id":1406,"date":"2022-04-01T10:28:58","date_gmt":"2022-04-01T14:28:58","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/tessent\/?p=1406&#038;preview=true&#038;preview_id=1406"},"modified":"2026-03-26T16:06:46","modified_gmt":"2026-03-26T20:06:46","slug":"join-siemens-eda-at-ip-soc-silicon-valley","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/tessent\/2022\/04\/01\/join-siemens-eda-at-ip-soc-silicon-valley\/","title":{"rendered":"Siemens EDA talks cybersecurity at IP-SoC Silicon Valley"},"content":{"rendered":"\n<p>The Tessent group participated in the \u201cunique event fully dedicated to IP and IP-based electronic systems,\u201d D&amp;R IP-SoC Silicon Valley at the Computer History Museum in Mountain View, California on April 26, 2022. The two-day event highlighted the latest technological trends and exciting innovative IP\/SoC products available to the electronics industry. Siemens was a gold sponsor of this event.\u00a0<\/p>\n\n\n\n<p>Siemens EDA presented \u201cCybersecurity threat detection and mitigation: a new hardware-based approach.\u201d Robert Rand, a Solution Architect with the Tessent\u2122 Embedded Analytics business segment, will discuss the need to defend systems against malicious actors. The presentation introduces a hardware-based solution that supplements standard cybersecurity architectures.\u00a0\u00a0<\/p>\n\n\n\n<p>For details, download the related technical paper, <a href=\"https:\/\/resources.sw.siemens.com\/en-US\/white-paper-cybersecurity-the-case-for-hardware-based-threat-detection-and-mitigation\" target=\"_blank\" rel=\"noopener\">Cybersecurity: the case for hardware-based threat detection and mitigation<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The Tessent group participated in the \u201cunique event fully dedicated to IP and IP-based electronic systems,\u201d D&amp;R IP-SoC Silicon Valley&#8230;<\/p>\n","protected":false},"author":71644,"featured_media":1408,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[5,1],"tags":[389,370,357],"industry":[53],"product":[269],"coauthors":[375],"class_list":["post-1406","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","category-news","tag-cybersecurity","tag-embedded-analytics","tag-tessent","industry-electronics-semiconductors","product-tessent"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/48\/2022\/04\/Siemens_DR-SoC-Days-Silicon-Valley-2022.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1406","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/users\/71644"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/comments?post=1406"}],"version-history":[{"count":3,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1406\/revisions"}],"predecessor-version":[{"id":1506,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/posts\/1406\/revisions\/1506"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media\/1408"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/media?parent=1406"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/categories?post=1406"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/tags?post=1406"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/industry?post=1406"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/product?post=1406"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/tessent\/wp-json\/wp\/v2\/coauthors?post=1406"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}