Join Tessent at the User2User and the VOICE developer conferences

DFT, operations, and Embedded Analytics at User2User

Tessent invites you to join us at three live and in-person events in May 2022.

User2User North America

Dedicated to end-users of Siemens EDA solutions, this conference is free to attend and includes innovative keynotes from industry leaders, enriching technical sessions as well as a chance to network with colleagues and peers.

Tessent features use case presentations from some of the most successful chip companies. The customer presentations include using multi-transition fault model patterns for 0 DPPB test, improving test results with ATPG Boost, 3D IC test, and using Tessent Streaming Scan Network. A Tessent representative will present on DFT for tile-based designs.

While these presentations are the stars of U2U, Tessent will also host a “Big Idea” Lounge where you can get your hands on an IJTAG demo and learn more about Tessent Embedded Analytics.

User2User Europe

User2User in Munich features presentations from customers and partners on using Embedded Analytics (EA) to detect and mitigate cybersecurity attacks, using EA in 5G baseband ICs, smart ASIC monitoring, logic BIST usage in an automotive IC, and hierarchical DFT improvement.

VOICE

We also look forward to seeing you at the VOICE Developer Conference, held live in North America from 17-18 May, 2022. VOICE is a conference created by test engineers for test engineers, so is a great opportunity for gathering meaty information. Register now to reserve access to information about the lasted technology advancements, new ideas, best practices, and professional networking.

Tessent presentations at VOICE:

Maximizing Scan Throughput with Tessent SSN on the V93000
In this presentation, Geir Eide of Siemens and Michael Braun of Advantest describe how Tessent Streaming Scan Network can help reduce DFT implementation efforts and maximize throughput.
Paper 81-HPD

Maximizing Scan Throughput with Tessent SSN on the V93000

V93000 SmartShell Improves the Capability to Support Broader Application Needs with Tessent Silicon Insight
Hear Kyoshi Takashita and Matthew Knowles of Siemens with Jinlei Lui and Rita Lu of Advantest demonstrate the latest enhancements to SmartShell that improve the usability and flexibility in device bring-up. Paper 99-HSDI

V93000 SmartShell Improves the Capability to Support Broader Application Needs with Tessent Silicon Insight

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