{"id":3290,"date":"2019-09-03T13:07:39","date_gmt":"2019-09-03T20:07:39","guid":{"rendered":"https:\/\/blogs.plm.automation.siemens.com\/t5\/Solid-Edge-Blog\/Resolving-PCB-design-collaboration-issues\/ba-p\/620591"},"modified":"2026-03-26T07:23:35","modified_gmt":"2026-03-26T11:23:35","slug":"resolving-pcb-design-collaboration-issues","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/solidedge\/resolving-pcb-design-collaboration-issues\/","title":{"rendered":"Resolving PCB Design Collaboration Issues"},"content":{"rendered":"<p><span style=\"font-weight: 400\">When designing <\/span><a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/pcb-design\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\">printed circuit boards (PCB)<\/span><\/a><span style=\"font-weight: 400\"> during product development, coordination between mechanical and electrical engineers is critical. While this collaboration is important to the design of all electromechanical products, it&#8217;s especially challenging when adding PCBs into products with only recently added electrical content. <\/span><\/p>\n<p><span style=\"font-weight: 400\">The ability or inability of teams to work seamlessly together impacts all stages of product development.<\/span><\/p>\n<p><span style=\"font-weight: 400\">Communication and collaboration between domains is enhanced by working in an integrated 3D CAD environment. <\/span><\/p>\n<p><span style=\"font-weight: 400\">With an integrated <\/span><a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/pcb-design\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\">3D view of PCB layout<\/span><\/a><span style=\"font-weight: 400\">, both mechanical and electrical engineers can immediately validate designs to identify over- and under-constrained areas, thereby freeing up real estate and reducing the number of potential electrical concerns.<\/span><\/p>\n<h2><span style=\"font-weight: 400\">Accelerate and improve PCB design development<\/span><\/h2>\n<p><span style=\"font-weight: 400\">Our latest white paper titled, \u201c<\/span><a href=\"https:\/\/solidedge.siemens.com\/en\/resource\/white-paper\/enabling-fast-pcb-development\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\">Enabling Fast PCB Development<\/span><\/a><span style=\"font-weight: 400\">\u201d, outlines how to effectively deal with ECAD-MCAD collaboration issues in PCB design and the benefits of using <\/span><a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/pcb-collaboration\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\">3D technology in Solid Edge<\/span><\/a><span style=\"font-weight: 400\"> to enhance collaborative efforts between domains.<\/span><\/p>\n<p><span style=\"font-weight: 400\">Effective ECAD-MCAD collaboration provides the following benefits:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400\"><span style=\"font-weight: 400\">Increases productivity<\/li>\n<li style=\"font-weight: 400\"><span style=\"font-weight: 400\">Improves design robustness<\/li>\n<li style=\"font-weight: 400\"><span style=\"font-weight: 400\">Increases collaboration and efficiency<\/li>\n<li style=\"font-weight: 400\"><span style=\"font-weight: 400\">Enables first-pass success<\/li>\n<\/ul>\n<p><span style=\"font-weight: 400\">Being able to view and understand information in 3D puts you in a position to create better PCB layouts from the start, both electronically and mechanically. Solid Edge provides you with full control over design intent and seamless communication between engineering domains, resulting in high-quality designs.<\/span><\/p>\n<h2><span style=\"font-weight: 400\">PCB Design and Collaboration in Solid Edge<\/span><\/h2>\n<p><span style=\"font-weight: 400\"><a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/pcb-design\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">Solid Edge PCB Design<\/a> provides schematic capture and PCB layout tools that provide sketch routing, hierarchical 2D\/3D planning and placement, and <a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/harness-design\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">ECAD-MCAD<\/a> collaboration.<\/span><\/p>\n<p><a href=\"https:\/\/solidedge.siemens.com\/en\/solutions\/products\/electrical-design\/pcb-design\/\" target=\"_blank\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\"><span class=\"lia-inline-image-display-wrapper lia-image-align-inline\" style=\"width: 400px\"><img decoding=\"async\" class=\"alignnone\" title=\"PCB-Development-Collaboration-960x540.png\" src=\"http:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/8\/2019\/09\/PCB-Development-Collaboration-960x540-1.png\" alt=\"PCB-Development-Collaboration-960x540.png\" \/><\/span><\/span><\/a><\/p>\n<p><span style=\"font-weight: 400\">Fully integrated 3D layout with placement, constraints, design rule checking (DRC) and photo-realistic visualization minimizes MCAD iterations. Solid Edge PCB Design uses a complete set of 3D constraints with dynamic collision detection and batch verification to ensure error-free electromechanical design.<\/span><\/p>\n<p><a href=\"https:\/\/solidedge.siemens.com\/en\/resource\/white-paper\/enabling-fast-pcb-development\/\" target=\"_self\" rel=\"nofollow noopener noreferrer\"><span style=\"font-weight: 400\">Download the white paper today.<\/span><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>When designing   printed circuit boards (PCB)   during product development, coordination between mechanical and electrical engineers is critical. While this collaboration is important to the design o&#8230;<\/p>\n","protected":false},"author":30919,"featured_media":3291,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[20],"industry":[],"product":[],"coauthors":[],"class_list":["post-3290","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/8\/2019\/09\/SE_Electromechanical_System_Changes_600x300.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/posts\/3290","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/users\/30919"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/comments?post=3290"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/posts\/3290\/revisions"}],"predecessor-version":[{"id":10632,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/posts\/3290\/revisions\/10632"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/media\/3291"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/media?parent=3290"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/categories?post=3290"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/tags?post=3290"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/industry?post=3290"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/product?post=3290"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/solidedge\/wp-json\/wp\/v2\/coauthors?post=3290"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}