{"id":4891,"date":"2015-03-02T08:48:20","date_gmt":"2015-03-02T15:48:20","guid":{"rendered":"https:\/\/blogs.mentor.com\/robinbornoff\/?p=4891"},"modified":"2026-03-27T08:58:42","modified_gmt":"2026-03-27T12:58:42","slug":"mentor-graphics-at-semi-therm-31-dolly-the-heatsink-and-much-more","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/2015\/03\/02\/mentor-graphics-at-semi-therm-31-dolly-the-heatsink-and-much-more\/","title":{"rendered":"Mentor Graphics at Semi-Therm 31 &#8211; &#8216;Dolly the Heatsink&#8217; and much more"},"content":{"rendered":"<p>Semi-Therm, the world&#8217;s largest dedicated electronics thermal conference, will take place between March 15-19 at the Doubletree Hotel in San Jose, California. Now in it&#8217;s 31st year, this IEEE sponsored conference maintains its high standards in peer reviewed papers covering a range of disciplines within the electronics cooling field.<\/p>\n<hr \/>\n<p>As usual, the Mechanical Analysis Division of Mentor Graphics will be in attendance. Our division will be presenting 4 papers:<\/p>\n<p>&nbsp;<\/p>\n<ul>\n<li>\u00a0&#8220;An Additive Design Heatsink Geometry Topology Identification and Optimization Algorithm&#8221; <em>Robin Bornoff, John Parry<\/em>. 3D printing is set to revolutionise rapid prototyping and manufacturing. Thermal design techniques will have to adapt to reflect the opportunities this presents. Myself and John have identified a novel approach to heatsink design, inspired by Bejan&#8217;s <a href=\"http:\/\/www.mems.duke.edu\/bejan-constructal-theory\" target=\"_blank\" rel=\"noopener noreferrer\">Constructal Law<\/a>, that results in a heatsink topology being &#8216;grown&#8217; based on a series of successive <a href=\"http:\/\/www.mentor.com\/products\/mechanical\/flotherm\/flotherm\/\" target=\"_blank\" rel=\"noopener noreferrer\">FloTHERM<\/a> simulations. The details of &#8216;<a href=\"http:\/\/en.wikipedia.org\/wiki\/Dolly_%28sheep%29\" target=\"_blank\" rel=\"noopener noreferrer\">Dolly<\/a> the Heatsink&#8217; and how she was developed will be presented in Session 11 &#8220;Enhanced Heat Transfer&#8221; on Thursday March 19.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS2.png\">\u00a0<\/a><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS1.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone wp-image-4892\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS1-520x263.png\" alt=\"DHS1\" width=\"304\" height=\"154\" \/>\u00a0\u00a0\u00a0 <\/a><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS2.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone  wp-image-4893\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS2-520x346.png\" alt=\"DHS2\" width=\"281\" height=\"187\" \/><\/a><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/DHS1.png\"><br \/>\n<\/a><\/p>\n<ul>\n<li>&#8220;Lifetime Estimation of Power Electronics Modules Considering the Target Application&#8221;. <em>Attila<\/em> <em>Szel, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, Marta Rencz<\/em>. Reliability prediction of power inverter modules involves a combination of both experimental methods to derive lifetime characteristics and simulation of the device under actual operating conditions. This flow will be presented in Session 12 &#8220;Quality and Reliability&#8221; on Thursday March 19.<\/li>\n<\/ul>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/SurfaceTemps.gif\">\u00a0\u00a0\u00a0 <\/a><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/MagGrdTs.gif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-4906\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/MagGrdTs.gif\" alt=\"MagGrdTs\" width=\"350\" height=\"106\" \/><\/a><\/p>\n<p>&nbsp;<\/p>\n<p><a href=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/SurfaceTempss.gif\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-4907\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/56\/2015\/03\/SurfaceTempss.gif\" alt=\"SurfaceTempss\" width=\"350\" height=\"182\" \/><\/a><\/p>\n<ul>\n<li>&#8220;Application of the Transient Dual Interface Method in Test Based Modeling of Heat-sinks Aimed at Socket-able LED Modules&#8221; <em>Andr\u00e1s Poppe, Guszt\u00e1v Hantos (BUTE), J\u00e1nos Heged\u0171s (BUTE).<\/em> Another application of the method that underpins JESD15-14, to be presented in Session 9 &#8220;Measurements and Characterization II&#8221; again on Thursday March 19.<\/li>\n<\/ul>\n<ul>\n<li>&#8220;Range and Probabilities of LED Junction Temperature Predictions based upon Forward Voltage Population Statistics&#8221; <em>James Petroski<\/em>. To be presented in Session 12 &#8220;Quality and Reliability&#8221; on Thursday March 19.<\/li>\n<\/ul>\n<p>So, Thursday March 19th, a date for your diaries! I will also be presenting at one of the two vendor presentation sessions on the 17th or 18th (tbd) where I will show the forthcoming, major and exciting features of FloTHERM V11 with a focus on workflow automation.<\/p>\n<p>I&#8217;ll do my best to leave the English weather where it belongs, in England, and see you in sunny CA soon!<\/p>\n<p>2nd March 2015, Ross-on-Wye<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Semi-Therm, the world&#8217;s largest dedicated electronics thermal conference, will take place between March 15-19 at the Doubletree Hotel in San&#8230;<\/p>\n","protected":false},"author":71715,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[3,42,65,80,118,128,177,190],"industry":[],"product":[],"coauthors":[],"class_list":["post-4891","post","type-post","status-publish","format-standard","hentry","category-news","tag-1500a-power-tester","tag-constructal","tag-electronics-cooling","tag-flotherm","tag-igbt","tag-led","tag-semitherm","tag-t3ster"],"_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/posts\/4891","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/users\/71715"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/comments?post=4891"}],"version-history":[{"count":1,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/posts\/4891\/revisions"}],"predecessor-version":[{"id":6422,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/posts\/4891\/revisions\/6422"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/media?parent=4891"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/categories?post=4891"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/tags?post=4891"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/industry?post=4891"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/product?post=4891"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simulating-the-real-world\/wp-json\/wp\/v2\/coauthors?post=4891"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}