{"id":66313,"date":"2025-06-17T10:30:14","date_gmt":"2025-06-17T14:30:14","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=66313"},"modified":"2026-03-26T06:46:25","modified_gmt":"2026-03-26T10:46:25","slug":"too-hot-too-shaky-thermal-testing-and-vibration-control-testing-for-electronics","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/too-hot-too-shaky-thermal-testing-and-vibration-control-testing-for-electronics\/","title":{"rendered":"Too hot – too shaky? Thermal testing and vibration control testing come to the rescue of electronic systems"},"content":{"rendered":"\n

According to an older study by the U.S. Air Force Avionics Integrity Program, 75 percent of electronic system failures are the result of high temperatures (55%) and excessive vibrations (20%). Those physics didn’t change over the years, but in today\u2019s technological landscape, electronic components, designs and packages are becoming increasingly complex, high-performant and compact. This makes it extremely challenging to keep the temperature and structural integrity under control and puts the focus on the thermal and mechanical design. Read on to understand how thermal testing and vibration control testing help survive today’s and future electronic designs.<\/p>\n\n\n

\n
\"\"
Environmental causes of failure in defense-related electronic systems (source: US Air Force)<\/em><\/figcaption><\/figure><\/div>\n\n\n

Too hot?<\/h2>\n\n\n\n

Electronics manufacturers face challenges in developing more accurate and efficient thermal designs, conducting detailed thermal performance validations and gaining a better understanding of the thermal behavior and lifetime reliability of new designs and materials. However, accurately simulating the internal thermal structure and the behavior of new designs remains a complex task. <\/p>\n\n\n\n

Thermal testing<\/h2>\n\n\n\n

Addressing these challenges requires a combined test and simulation approach for designing electronics in a precise, detailed and time-efficient manner. Using Simcenter\u2122 Micred\u2122 hardware and software<\/a> plays a vital role in measuring the thermal metrics and performance of electronic components under static and dynamic conditions. This information is crucial for creating accurate thermal simulation models at earlier stages of the design process.<\/p>\n\n\n

\n
\"\"
Simcenter Micred T3STER for thermal testing and characterization<\/em><\/figcaption><\/figure><\/div>\n\n\n

Too shaky?<\/h2>\n\n\n\n

Electronic components are used in a variety of products, from power electronics in electric cars, railway and energy conversion, to high-performance computing and daily consumer electronics. Next to high temperatures and temperature variations, those products are subject to various vibration levels during their service life that deteriorates their integrity, leading to possible breakdown of the whole product.<\/p>\n\n\n\n

Vibration control testing<\/h2>\n\n\n\n

Vibration control testing<\/a> is a crucial step in a product’s validation process. Manufacturers can identify potential design issues early in the process using a unique combination of Simcenter hardware and software. It bundles best-in-class acquisition hardware with predefined software templates to perform accurate closed-loop shaker tests with various input excitation profiles, ranging from standard sine to random, shock and tracked sine dwell. <\/p>\n\n\n\n

Simcenter Testing solutions – a combined approach<\/h2>\n\n\n\n

In our Simcenter Testing solutions portfolio, we uniquely offer specific solutions for both the thermal testing as well as the vibration control testing. Combined with our Simcenter simulation solutions, this approach delivers accurate digital twins for fast performance validation of the different multiphysics aspects of your electronics.<\/p>\n\n\n

\n
\"\"
Simcenter Testing offers both thermal testing as well as vibration control testing.<\/em><\/figcaption><\/figure><\/div>\n\n\n

Interested to know more ? Please find below more info:<\/p>\n\n\n\n