{"id":53627,"date":"2023-12-11T09:16:00","date_gmt":"2023-12-11T14:16:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=53627"},"modified":"2026-03-26T06:33:47","modified_gmt":"2026-03-26T10:33:47","slug":"simcenter-floefd-2312-whats-new","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/simcenter-floefd-2312-whats-new\/","title":{"rendered":"What\u2019s new in Simcenter FLOEFD 2312? | CAD-embedded CFD simulation"},"content":{"rendered":"\n

The new Simcenter FLOEFD 2312 software release enhances CAD-embedded CFD to shorten pre-processing activities, accelerate electronics thermal design workflows, while adding new capabilities for structural analysis, and an improved Application Programming Interface (API) for simulation automation. Read on below for information on these and new features such as faster CFD meshing<\/a> of convergent geometry, improved speed for Smart PCB <\/a>thermal modeling, PCB reflow oven modeling, and more.<\/p>\n\n\n\n

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Model the complexity<\/p>\n<\/div><\/div>\n\n\n\n

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PCB reflow oven thermal process simulation<\/h2>\n\n\n\n

IIn a PCB reflow oven, as a PCB moves along a conveyor it is exposed to heating and cooling zones with different air flow velocity and temperature parameters.

Values for these zones\u2019 parameters as well as the conveyer speed are to be chosen by the PCB customer prior to manufacturing.  The operation design challenge is to increase the conveyer speed for highest throughput while meeting thermal constraints to avoid damage to PCB mounted components. Experimental approaches to determine these parameters are expensive because failed attempts lead to lost time, reduced product quality or low throughput. Simulation of the reflow oven process to optimize operational parameters prior to physical tests is very advantageous.

In Simcenter FLOEFD 2312, a project template has been added so you can create and modify a PCB reflow oven simulation as a transient study to reflect conditions as a board moves through an oven. The template leverages the project parameters functionality in Simcenter FLOEFD and the new EFDAPI automation capabilities is used to modify parameters. The approach simulates the reflow process inside a small volume space around the PCB with moving flow boundary conditions instead of simulating the real oven with moving bodies.<\/p>\n\n\n\n

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Watch this video to see indicative steps in setting up and running a PCB reflow oven thermal process simulation.<\/p>\n\n\n

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