{"id":48666,"date":"2023-04-03T08:00:00","date_gmt":"2023-04-03T12:00:00","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=48666"},"modified":"2026-03-26T06:42:25","modified_gmt":"2026-03-26T10:42:25","slug":"simcenter-at-cmse-2023-conference","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/simcenter-at-cmse-2023-conference\/","title":{"rendered":"Simcenter at CMSE 2023 Conference"},"content":{"rendered":"\n

Do you develop electronic components used in military and space applications?  If so, then you should check out the upcoming, 26th annual Components for Military and Space Electronics (CMSE) conference<\/a> that will be taking place in Los Angeles, CA USA on April 25-27, 2023.  This is a technical conference focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.<\/p>\n\n\n\n

Simcenter<\/a> can help you engineer electronic component every step of the way through the use of integrated thermal and structural simulation and calibration of your thermal models through physical testing.<\/p>\n\n\n\n

Attend the technical presentation<\/h2>\n\n\n\n

Engineers from Siemens DISW will be on-hand at CMSE 2023 and will be presenting a technical paper at the conference on Thursday, April 27<\/strong>:<\/p>\n\n\n\n

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An Integrated Workflow for Semiconductor Package Design<\/strong><\/h3>\n\n\n\n

Albert Prosuk \/ Jimmy He \/ Andras Vass-Varnai<\/p>\n\n\n\n

Abstract<\/strong><\/p>\n\n\n\n

Semiconductor companies are approaching their reckoning with Augustine\u2019s law as continued efforts to keep up with Moore\u2019s law, the increasing demand for computational power, and the widespread applications of edge computing are exponentially increasing design complexity. All the while semiconductor companies must not increase product time to market, give up on profit margins, or sacrifice on quality. This is leading to advanced packaging being more important than ever and we are seeing packaging complexity increase exponentially with 2.5D\/3D designs. So, just like the aerospace companies before them the semiconductor industry must adopt a model-based system engineering approach that emphasizes an integrated product design workflow.<\/p>\n<\/div><\/div>\n\n\n\n

Visit the Siemens booth<\/strong><\/h2>\n\n\n\n

Siemens DISW will also have a presence as an exhibitor at CMSE 2023, and we\u2019ll have two products from the Simcenter Micred product family used for electronic component thermal testing that you will be able to view first-hand while you\u2019re there:<\/p>\n\n\n\n

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Simcenter Micred T3STER<\/strong><\/h3>\n\n\n\n

Simcenter Micred T3STER<\/a> is an advanced non-destructive transient thermal tester for the thermal characterization of packaged semiconductor devices (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. Simcenter Micred T3STER helps you confirm that packages as manufactured match their designed thermal performance which can be impaired by contact resistances within the material stack and voids in glue and solder layers.<\/p>\n<\/div>

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Simcenter Micred LED Tester<\/strong><\/h3>\n\n\n\n

Simcenter Micred LED Tester<\/a> accurately describe the thermal properties of LEDs using an integrated thermal, photometric and radiometric testing station.  This will help you understand if your LEDs are meeting your design performance requirements.<\/p>\n<\/div><\/div>\n\n\n\n

Register for CMSE 2023<\/strong><\/h2>\n\n\n\n

If you\u2019re an electronic component engineer in the aerospace industry, you won\u2019t want to miss this event.  You can see the full agenda and register for the event by clicking the buttons below:<\/p>\n\n\n\n

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CMSE 2023 Technical Program<\/a><\/div>\n\n\n\n
CMSE 2023 Registration<\/a><\/div>\n<\/div>\n\n\n\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

Attend the Components for Military and Space Electronics (CMSE 2023) conference to learn how Simcenter can help you engineer semiconductor package design through an integrated workflow.<\/p>\n","protected":false},"author":59783,"featured_media":48674,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,81],"tags":[18638,5,46959,10824,22904,658,18631,63902],"industry":[125,128],"product":[50920,63581],"coauthors":[717],"class_list":["post-48666","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-event","tag-aerospace-engineering","tag-cae-simulation","tag-conference","tag-electronics-semiconductors","tag-events","tag-physical-testing","tag-thermal-analysis","tag-thermal-testing","industry-aerospace-defense","industry-avionics-defense-electronics","product-simcenter","product-simcenter-micred"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2023\/03\/cmse-stars.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/48666","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/users\/59783"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/comments?post=48666"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/48666\/revisions"}],"predecessor-version":[{"id":48675,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/48666\/revisions\/48675"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media\/48674"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media?parent=48666"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/categories?post=48666"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/tags?post=48666"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/industry?post=48666"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/product?post=48666"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/coauthors?post=48666"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}