{"id":17971,"date":"2020-09-04T11:51:50","date_gmt":"2020-09-04T15:51:50","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=17971"},"modified":"2026-03-26T06:23:38","modified_gmt":"2026-03-26T10:23:38","slug":"heatsink-optimization-virtual-therminic-2020-topics","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/heatsink-optimization-virtual-therminic-2020-topics\/","title":{"rendered":"Heat sink optimization among thermal topics at THERMINIC 2020"},"content":{"rendered":"\n<p>Heat sink optimization, thermo-mechanical reliability, power electronics and many more high demand topics in electronics thermal management are all included in the virtual <a href=\"https:\/\/therminic2020.eu\/\" target=\"_blank\" rel=\"noreferrer noopener\">THERMINIC 2020<\/a> program. The 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) is going virtual with an exciting combination of video presentations and a varied, interactive live day on September 24, 2020 &#8211; read more below.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Thermal analysis, novel cooling technologies, reliability and more <\/h2>\n\n\n\n<p>The THERMINIC conference program is now <a href=\"https:\/\/www.conftool.pro\/therminic2020\/index.php?page=browseSessions&amp;path\" target=\"_blank\" rel=\"noopener\">on-line<\/a> \u2013 click on the sessions to see an expanded view of what\u2019s being presented. The committee has comprehensively filled a total of 14 live and 38 pre-recorded presentations, plus a few short sponsor technical talks. Siemens Digital Industries Software will be presenting it latest technology for thermal management of electronics in simulation, design exploration and thermal testing. <\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Heat sink optimization presentation<\/h2>\n\n\n\n<p>I have co-authored a technical paper with Robin Bornoff, Matt Warner, and Matthew Sapiano titled &#8220;<em><strong>A Geometry Remodeling Approach to Heatsink Optimisation&#8221;<\/strong><\/em>. Robin Bornoff will be presenting it live at Therminic.  To give you a quick taster,  Robin has prepared a 3 minute video summary of his live conference presentation which you can view below.<\/p>\n\n\n\n<figure class=\"wp-block-video aligncenter\"><video controls loop src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/08\/TherminicHeatsinkBornoffTopicInsight.mp4\"><\/video><figcaption>3 minute video: <em>A Geometry remodeling approach to heatsink optimization<\/em><\/figcaption><\/figure>\n\n\n\n<p>At THERMINIC, 3-minute video summaries will be used to introduce each of the 38 pre-recorded presentations so you can easily prioritize the order to then view the full on-demand presentations.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">Explore and register for virtual THERMINIC 2020<\/h2>\n\n\n\n<p>Join industry peers<strong> September 24th <\/strong>for the live presentations of the keynote and the 15 highest ranked papers, short pitches of all other presentations, live debates and the best paper award ceremony!<\/p>\n\n\n\n<p><a href=\"https:\/\/therminic2020.eu\/registration\/\" target=\"_blank\" rel=\"noopener\">Registering<\/a> in advance gives you access to all the contributions online as video presentations 10 days prior to the workshop so you can enjoy viewing all contributions in your own time.<br><\/p>\n\n\n\n<h3 class=\"wp-block-heading\"><strong>Heatsink thermal design and simulation related Siemens resources<\/strong>:<\/h3>\n\n\n\n<p>On Demand Webinar:  <a href=\"https:\/\/www.plm.automation.siemens.com\/global\/en\/webinar\/heatsink-thermal-design\/95701\" target=\"_blank\" rel=\"noreferrer noopener\">Heatsink thermal design \u2013 Key considerations for electronics cooling<\/a><br><br>Blog: <a href=\"https:\/\/blogs.sw.siemens.com\/simcenter\/how-to-design-a-heat-sink-for-additive-manufacturing\/\" target=\"_blank\" rel=\"noreferrer noopener\">How to Design a Heat Sink for Additive Manufacturing<\/a><br><br>Video on YouTube: <a href=\"https:\/\/www.youtube.com\/watch?v=C_trNrsNZOA\" target=\"_blank\" rel=\"noreferrer noopener\">Celsia | CFD simulation in heatsink design<\/a><br><br>Explore heatsink thermal design in an online 30 day cloud based trial of either <a href=\"https:\/\/trials.sw.siemens.com\/simcenter-flotherm\/\" target=\"_blank\" rel=\"noreferrer noopener\">Simcenter Flotherm<\/a> (for thermal analysts) or <a href=\"https:\/\/trials.sw.siemens.com\/simcenter-flotherm-xt\/\" target=\"_blank\" rel=\"noreferrer noopener\">Simcenter Flotherm XT<\/a> (CAD Centric electronics cooling software). <br><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Heat sink optimization, thermo-mechanical reliability, power electronics and many more high demand topics in electronics thermal management are all included&#8230;<\/p>\n","protected":false},"author":69040,"featured_media":18109,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[81,1],"tags":[83,242,244],"industry":[146,147,145,148,149],"product":[503],"coauthors":[7403],"class_list":["post-17971","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-event","category-news","tag-additive-manufacturing","tag-computational-fluid-dynamics-cfd","tag-design-exploration","industry-consumer-industrial-electronics","industry-electronic-manufacturing-services","industry-electronics-semiconductors","industry-semiconductor-devices","industry-semiconductor-equipment","product-simcenter-flotherm"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/09\/HeatsinkTherminic.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/17971","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/users\/69040"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/comments?post=17971"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/17971\/revisions"}],"predecessor-version":[{"id":35038,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/17971\/revisions\/35038"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media\/18109"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media?parent=17971"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/categories?post=17971"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/tags?post=17971"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/industry?post=17971"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/product?post=17971"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/coauthors?post=17971"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}