{"id":12107,"date":"2020-03-26T07:08:27","date_gmt":"2020-03-26T11:08:27","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=12107"},"modified":"2026-03-26T06:21:30","modified_gmt":"2026-03-26T10:21:30","slug":"so-what-is-fowlp-and-its-applications","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/so-what-is-fowlp-and-its-applications\/","title":{"rendered":"So what is FOWLP and its applications?"},"content":{"rendered":"\n<p>Well, simply put, it is a relatively new high-density advanced packaging technology: Fan-Out Wafer-Level Packaging. Smartphones and wireless multimedia are the first large commercial segment to use FOWLP designs, as seen in the newer iPhones from Apple.&nbsp; Most recently, the growth in vehicle electrification and autonomy is also driving increasing application of FOWLP solutions.<\/p>\n\n\n\n<p>Unlike most WLP packaging flows, where the integrated\ncircuit on the wafer is encapsulated and then diced, like conventional\npackaging, the FOWLP process dices the wafer first. The clever bit is in the\nway the die is overmolded and the redistribution layer (RDL) created, to\nprovide fan out for the solder balls. <\/p>\n\n\n\n<p>FOWLP offers multiple advantages over conventional\npackaging technologies:<\/p>\n\n\n\n<ul class=\"wp-block-list\"><li>Higher performance<\/li><li>Shorter interconnect paths lead to fewer\nparasitics and less delay.<\/li><li>Shorter paths to heatsinks reduce concerns about\n*thermal impacts and resistance.<\/li><li>Lower power consumption.<\/li><li>Improved form factor<\/li><li>Thinner and lighter than traditional 2.5D and 3D\npackaging<\/li><li>Option to place even more components vertically,\nreducing footprint.<\/li><\/ul>\n\n\n\n<p>*Thermally, one of the main benefits of having a package\nthat is larger than the die is that it can help spread the heat before it is\nremoved by a heatsink. FOWLP has the unfortunate effect of kicking that\nparticular can down the road, placing greater demands on the thermal performance\nof the board, heatsink, and thermal interface material between heatsink and\npackage.<\/p>\n\n\n\n<p>The good news is that with the new Package Creator module, delivered with the Simcenter Flotherm XT 2019.3 release, we are offering modelling support for FOWLP devices.&nbsp; The image below shows the set-up for the RDL for a typical FOWLP design. <\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"676\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1-1024x676.png\" alt=\"\" class=\"wp-image-12235\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1-1024x676.png 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1-600x396.png 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1-768x507.png 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1-1110x732.png 1110w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/2020-03-23_14-27-18-1.png 1426w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p>Try Simcenter Flotherm XT for yourself with a <a href=\"https:\/\/www.mentor.com\/products\/product-eval\/thermal-design-flotherm-xt-ultra\" target=\"_blank\" rel=\"noopener\">free 30-day cloud evaluation<\/a>. Become proficient at driving Simcenter Flotherm XT Ultra by working through case studies. Use Simcenter Flotherm XT\u2019s Smartparts and Parts Library to create accurate thermal models faster; capture Electronic data using FloEDA Bridge; and visualize the results on the original CAD geometry. <\/p>\n","protected":false},"excerpt":{"rendered":"<p>Well, simply put, it is a relatively new high-density advanced packaging technology: Fan-Out Wafer-Level Packaging. Smartphones and wireless multimedia are&#8230;<\/p>\n","protected":false},"author":69040,"featured_media":12233,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,179],"tags":[242,10822],"industry":[165],"product":[],"coauthors":[7403],"class_list":["post-12107","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-product-updates","tag-computational-fluid-dynamics-cfd","tag-electronics-cooling","industry-media-telecommunications"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/Capture.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/12107","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/users\/69040"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/comments?post=12107"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/12107\/revisions"}],"predecessor-version":[{"id":19901,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/12107\/revisions\/19901"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media\/12233"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media?parent=12107"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/categories?post=12107"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/tags?post=12107"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/industry?post=12107"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/product?post=12107"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/coauthors?post=12107"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}