{"id":11112,"date":"2020-03-23T07:34:47","date_gmt":"2020-03-23T11:34:47","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/simcenter\/?p=11112"},"modified":"2026-03-26T06:43:16","modified_gmt":"2026-03-26T10:43:16","slug":"the-times-they-are-a-changin","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/simcenter\/the-times-they-are-a-changin\/","title":{"rendered":"The times they are a changin’"},"content":{"rendered":"\n

As Bob Dylan sang \u201cthe times they are a changin\u2019\u201d, that\u2019s definitely true for the automotive industry. It is projected by the end of this century we\u2019ll say goodbye to the internal combustion engine, cars will drive us to our destination on their own, and flying taxis will help us cover longer distances, making traffic jams a thing of the past. <\/strong><\/p>\n\n\n\n

\"Improve<\/figure>\n\n\n\n

Perhaps one of the most important challenges for these\nnew technologies to meet is public safety. The electrical systems responsible\nfor traction, lighting, driver assistance or perhaps autonomous operation must work\nsafely and reliably at all times. Automotive OEMs understand this need well and\nestablish very strict quality requirements for the semiconductor components\nbuilt into the vehicles. As more and more systems become electric however, new\ncomponents, new package types, which have never been used in cars before are\nsuddenly required to meet new, stricter qualification guidelines.<\/p>\n\n\n\n

Siemens has a suite of test and simulation products\nto help semiconductor companies design, build and characterize semiconductor\ncomponents to meet the newly emerging requirements. Learn more about\nsemiconductor thermal characterization and lifetime testing to understand the\nway to component level reliability.<\/p>\n\n\n\n

1. White Paper:  Field Lifetime Estimation<\/strong> of Power Modules Using Active Power Cycling<\/h3>\n\n\n\n

As we all know, keeping costs down is an important priority when\ndesigning a product.  However, whenever a\ndesign changes, eg. the materials used, its reliability has to be tested\nthoroughly before the product can be moved with confidence into the production\nphase.  Generally, there are 2 options\nfor testing the lifetime of a power module: Temperature Cycling and Active Power\nCycling.  This white paper guides you\nthrough the whys and hows of these tests and provides an insight into the\nreasons you would choose one over the over. \n<\/p>\n\n\n\n

Download the paper >><\/a><\/p>\n\n\n\n

2. Web Seminar: Simulating & Testing the Latest Technology for EV Power Modules<\/strong><\/h3>\n\n\n\n

On the 14th<\/sup> May, I will be presenting a\nweb seminar on this topic.  I have worked\nfor 13 years in this industry and I love to be able share what I have learnt\nvia these on-line events.  In this\ninstalment, I will explain how Simcenter Powertester can be used to create\nlifetime metrics for component families. \nJoin me to learn about thermal characterization techniques and active\npower cycling of Si and SiC power electronic components such as MOSFETs and\nIGBTs for automotive use.<\/p>\n\n\n\n

More info \/ Register >><\/a><\/p>\n\n\n\n

 3. Video: What is a Structure Function<\/strong><\/h3>\n\n\n\n

Watch this video to learn about the importance of\nStructure Functions and their role in investigating the integrity of your\npackages.  This video introduces the\nprinciples behind them and shows you how they can support package\ncharacterization and reliability analysis.<\/p>\n\n\n\n

View Now >><\/a><\/p>\n\n\n\n

Please join <\/a>my webinar on the 14th<\/sup> of May to understand together how semiconductor reliability as an important step toward automotive digitalization may give us all the confidence to hop into that flying taxi or to let go of the steering wheel in our autonomous vehicle in the near future.<\/p>\n","protected":false},"excerpt":{"rendered":"

Learn more about semiconductor thermal characterization and lifetime testing to understand the way to component level reliability.<\/p>\n","protected":false},"author":69582,"featured_media":11179,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1,123,184],"tags":[242,63900,63902],"industry":[89,145],"product":[517],"coauthors":[63046],"class_list":["post-11112","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","category-spotlight-on","category-webinar","tag-computational-fluid-dynamics-cfd","tag-simcenter-micred","tag-thermal-testing","industry-automotive-transportation","industry-electronics-semiconductors","product-simcenter-t3ster"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/6\/2020\/03\/Andris_Blog_Pic.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/11112","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/users\/69582"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/comments?post=11112"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/11112\/revisions"}],"predecessor-version":[{"id":11993,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/posts\/11112\/revisions\/11993"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media\/11179"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/media?parent=11112"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/categories?post=11112"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/tags?post=11112"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/industry?post=11112"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/product?post=11112"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/simcenter\/wp-json\/wp\/v2\/coauthors?post=11112"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}