{"id":976,"date":"2025-06-03T09:00:25","date_gmt":"2025-06-03T13:00:25","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/?p=976"},"modified":"2026-03-27T09:12:21","modified_gmt":"2026-03-27T13:12:21","slug":"subscribe-3d-ic-podcast","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/2025\/06\/03\/subscribe-3d-ic-podcast\/","title":{"rendered":"\ud83c\udfa7 Subscribe to the 3D IC podcast \u2014 your front row seat to the future of chip design"},"content":{"rendered":"\n<p><strong>Listen now on your favorite platform:<\/strong><\/p>\n\n\n\n<p>\ud83d\udd39 <a class=\"\" href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" target=\"_blank\" rel=\"noopener\">Spotify<\/a><br>\ud83d\udd39 <a class=\"\" href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" target=\"_blank\" rel=\"noopener\">Apple Podcasts<\/a><br>\ud83d\udd39 <a class=\"\" href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" target=\"_blank\" rel=\"noopener\">Amazon Music<\/a><br>\ud83d\udd39 <a class=\"\" href=\"https:\/\/www.youtube.com\/playlist?list=PL1m1vu8_quoAcV1ryR_0Q1gSLf6_VWY6e\" target=\"_blank\" rel=\"noopener\">YouTube Playlist<\/a><\/p>\n\n\n\n<p>\ud83d\udc49 <strong>Don\u2019t forget to bookmark the <a class=\"\" href=\"https:\/\/www.youtube.com\/playlist?list=PL1m1vu8_quoAcV1ryR_0Q1gSLf6_VWY6e\" target=\"_blank\" rel=\"noopener\">YouTube playlist<\/a> and subscribe on your favorite podcast app!<\/strong><\/p>\n\n\n\n<figure class=\"wp-block-embed is-type-video is-provider-youtube wp-block-embed-youtube wp-embed-aspect-16-9 wp-has-aspect-ratio\"><div class=\"wp-block-embed__wrapper\">\n<iframe loading=\"lazy\" title=\"Siemens EDA 3D IC Podcast\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/videoseries?list=PL1m1vu8_quoAcV1ryR_0Q1gSLf6_VWY6e\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>\n<\/div><\/figure>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>What is 3D IC \u2014 and why should you care?<\/strong><\/h2>\n\n\n\n<p>As the world demands smarter, faster, more compact electronics, traditional chip design methods are hitting their limits. Enter <strong>3D Integrated Circuits (3D ICs)<\/strong> \u2014 a revolutionary approach to chip design that stacks and connects components vertically instead of side-by-side.<\/p>\n\n\n\n<p>In this <strong>exclusive Siemens EDA podcast series<\/strong>, you\u2019ll hear from industry experts, innovators, and engineers as they unpack the technology, challenges and real-world applications driving the future of semiconductor design.<\/p>\n\n\n\n<p>\ud83c\udf99\ufe0f <strong>Whether you&#8217;re an engineer, designer, executive, or tech enthusiast, the 3D IC podcast is your go-to resource for staying ahead of the curve.<\/strong><\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>What you&#8217;ll learn in the podcast<\/strong><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>\ud83d\udd0d <strong>What makes 3D IC a game-changer<\/strong> for chip performance and efficiency<\/li>\n\n\n\n<li>\ud83d\udee0\ufe0f Real-world case studies and challenges from the engineers building tomorrow\u2019s systems<\/li>\n\n\n\n<li>\ud83d\udca1 Expert insights on design, manufacturing, packaging, and testing<\/li>\n\n\n\n<li>\ud83d\ude80 How 3D IC is enabling innovations in AI, mobile, automotive and beyond<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Why 3D IC matters now more than ever<\/strong><\/h2>\n\n\n\n<p>Modern electronics demand more functionality in smaller form factors. But with shrinking nodes and thermal limits, designers need a better solution \u2014 and <strong>3D IC is delivering<\/strong>. By stacking dies and enabling shorter interconnects, 3D ICs are achieving:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Higher performance<\/li>\n\n\n\n<li>Lower power consumption<\/li>\n\n\n\n<li>Smaller footprints<\/li>\n\n\n\n<li>Better bandwidth and signal integrity<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Start listening today<\/strong><\/h2>\n\n\n\n<p>\ud83c\udfa7 <strong>Catch the full podcast series here:<\/strong><br><a class=\"\" href=\"https:\/\/blogs.sw.siemens.com\/podcasts\/category\/3d-ic\/\">Siemens EDA \u2013 3D IC Podcast Series<\/a><\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Explore more from Siemens<\/strong><\/h2>\n\n\n\n<p>Want to dive even deeper? Learn how Siemens is helping drive innovation in 3D IC packaging and design:<br>\ud83d\udd17 <a class=\"\" href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/3d-ic-design\/?cmpid=9050\" target=\"_blank\" rel=\"noopener\">Explore Siemens 3D IC Solutions<\/a><\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>Subscribe, bookmark, and stay ahead of the curve<\/strong><\/h2>\n\n\n\n<p>Whether you binge all episodes or tune in weekly, the <strong>3D IC Podcast<\/strong> is your ticket to understanding the next wave of chip innovation.<\/p>\n\n\n\n<p>\u2705 <a class=\"\" href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" target=\"_blank\" rel=\"noopener\">Spotify<\/a><br>\u2705 <a class=\"\" href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" target=\"_blank\" rel=\"noopener\">Apple Podcasts<\/a><br>\u2705 <a class=\"\" href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" target=\"_blank\" rel=\"noopener\">Amazon Music<\/a><br>\u2705 <a class=\"\" href=\"https:\/\/www.youtube.com\/playlist?list=PL1m1vu8_quoAcV1ryR_0Q1gSLf6_VWY6e\" target=\"_blank\" rel=\"noopener\">YouTube Playlist<\/a><\/p>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Listen now on your favorite platform: \ud83d\udd39 Spotify\ud83d\udd39 Apple Podcasts\ud83d\udd39 Amazon Music\ud83d\udd39 YouTube Playlist \ud83d\udc49 Don\u2019t forget to bookmark the&#8230;<\/p>\n","protected":false},"author":71824,"featured_media":983,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[378],"tags":[473,482,471],"industry":[103],"product":[535,368],"coauthors":[509],"class_list":["post-976","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-podcast","tag-3d-ic","tag-ic-packaging","tag-semiconductors","industry-electronics-semiconductors","product-innovator3d-ic","product-xpedition-ic-packaging"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2025\/06\/3D-IC05a.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/976","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/users\/71824"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/comments?post=976"}],"version-history":[{"count":4,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/976\/revisions"}],"predecessor-version":[{"id":985,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/976\/revisions\/985"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media\/983"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media?parent=976"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/categories?post=976"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/tags?post=976"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/industry?post=976"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/product?post=976"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/coauthors?post=976"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}