{"id":880,"date":"2025-04-02T06:25:45","date_gmt":"2025-04-02T10:25:45","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/?p=880"},"modified":"2026-03-27T09:12:12","modified_gmt":"2026-03-27T13:12:12","slug":"innovator3d-ic-wins-2025-3d-incites-award","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/2025\/04\/02\/innovator3d-ic-wins-2025-3d-incites-award\/","title":{"rendered":"Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award"},"content":{"rendered":"\n

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging processes continue to shape next-generation semiconductor devices, companies that push the boundaries of what’s possible are at the forefront of industry recognition. Among these trailblazers is Siemens Digital Industries Software, whose Innovator3D IC platform has been named the winner of the prestigious 3D InCites Technology Enablement Award for 2025<\/a>.<\/p>\n\n\n\n

The 3D InCites Awards celebrate companies that have made significant contributions to final device development through groundbreaking solutions in design tools, device technology, processes, materials, and manufacturing. Siemens’ Innovator3D IC<\/a> platform stood out for its AI-enhanced co-design capabilities, system-centric planning, and predictive modeling for optimization across various parameters such as power, performance, area, cost, and reliability.\u00a0<\/p>\n\n\n\n

Introduced in September 2024, the platform serves as a consolidated cockpit for constructing a digital twin of the entire semiconductor package assembly, facilitating design planning, prototyping, predictive analysis, implementation, multi-physics analysis, and release to manufacturing. By offering a unified data model and system-level connectivity, Innovator3D IC ensures digital continuity and enables co-optimization across silicon, package, interposer, and PCB.<\/p>\n\n\n

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\"3D<\/figure><\/div>\n\n\n

Its AI-infused User eXperience, coupled with the System Technology Co-Optimization methodology pioneered by IMEC, allows design teams to optimize power, performance, area, and cost effectively. On the 3D InCites Member Spotlight Podcast<\/a>, Keith Felton, Principal Technical product manager for the Siemens IC packaging solutions, explains how AI is used in Innovator3D IC to help the tool make better decisions.<\/p>\n\n\n\n

Moreover, the platform’s early access to predictive modeling for SI\/PI\/EMIR\/Thermal and stress, along with seamless integration with mechanical CAD, ensures the delivery of well-qualified and optimized design scenarios ready for detailed implementation.<\/p>\n\n\n\n

In a landscape where 2.5D\/3DIC heterogeneous integration of chiplets represents a pivotal inflection point, Siemens’ Innovator3D IC emerges as a game-changer in driving design innovation and efficiency. By providing a holistic solution for system co-design, die, interposer, package, and PCB, this platform embodies the future of semiconductor design and integration. Its ability to address the evolving needs of the industry, from early planning to final sign-off, positions Siemens as a visionary leader in the microelectronics supply chain.<\/p>\n\n\n\n

As we navigate the complexities of advanced interconnect and packaging processes, the recognition of Siemens Innovator3D IC with the 3D InCites Technology Enablement Award for 2025 underscores the platform’s transformative impact on semiconductor design workflows. By harnessing the power of AI, predictive modeling, and system-centric planning, Siemens continues to drive the industry forward through cutting-edge solutions and advancements. Congratulations to Siemens Digital Industries Software on this well-deserved accolade and their commitment to shaping the future of semiconductor technology.<\/p>\n","protected":false},"excerpt":{"rendered":"

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…<\/p>\n","protected":false},"author":69244,"featured_media":882,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[473,482,533],"industry":[103,106],"product":[535,368],"coauthors":[546],"class_list":["post-880","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-3d-ic","tag-ic-packaging","tag-innovator3d-ic","industry-electronics-semiconductors","industry-semiconductor-devices","product-innovator3d-ic","product-xpedition-ic-packaging"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2025\/04\/3D-InCites-award-2025-.jpeg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/880","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/users\/69244"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/comments?post=880"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/880\/revisions"}],"predecessor-version":[{"id":893,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/880\/revisions\/893"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media\/882"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media?parent=880"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/categories?post=880"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/tags?post=880"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/industry?post=880"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/product?post=880"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/coauthors?post=880"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}