Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session to discuss semiconductor design and linking design to manufacturing for a sustainable semiconductor future.<\/p>\n\n\n\n
Munsey’s role straddles the convergence of EDA and PLM, emphasizing the industry’s pivot from individual semiconductors to holistic systems within larger ecosystems. This interconnectedness necessitates the sharing of technologies and methodologies between traditional EDA tools and multi-physics simulations.<\/p>\n\n\n\n
\nThe way the industry’s going – when we look at the tools and the methodologies that we need – it’s starting to move from just talking about semiconductors to talking about entire systems.<\/em><\/p>\nMichael Munsey, VP at Siemens EDA<\/cite><\/blockquote>\n\n\n\n
Driving forces behind chiplets and heterogeneous packaging <\/strong><\/h2>\n\n\n\n
Moore’s Law forces us to explore beyond monolithic silicon<\/em>, says Munsey. As systems become more advanced, there’s a dual push to not only enhance technologies but also manufacture sustainably. Munsey underlines that there’s a convergence of “pushing the state-of-the-art technology<\/em>\u201d with the pragmatic need for sustainable delivery.<\/p>\n\n\n\n
Sustainability in semiconductor technology <\/strong><\/h2>\n\n\n\n
Sustainability plays a key role across design, production, and throughout the device lifecycle. An example highlighted was Nvidia’s latest high-power-consuming chips, pointing towards the pressing need to power and cool them sustainably. Munsey also discussed advanced packaging methods capable of reducing power consumption, reinforcing the idea of creating devices that not only meet but exceed sustainable requirements.<\/p>\n\n\n\n