{"id":284,"date":"2023-09-13T08:28:20","date_gmt":"2023-09-13T12:28:20","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/?p=284"},"modified":"2026-03-27T09:11:59","modified_gmt":"2026-03-27T13:11:59","slug":"semiwiki-podcast-an-expert-panel-discussion-on-the-move-to-chiplets","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/2023\/09\/13\/semiwiki-podcast-an-expert-panel-discussion-on-the-move-to-chiplets\/","title":{"rendered":"SemiWiki Podcast &#8211; An expert panel discussion on the move to chiplets"},"content":{"rendered":"\n<p>Listen in as Tony Mastroianni Advanced Packaging Solutions Director &#8211; Siemens EDA along with Saif Alam Vice President of Engineering at\u00a0Movellus Inc. and Craig Bishop \u2013 CTO Deca Technologies join SemiWiki\u2019s founder Daniel Nenni to discuss chiplets and 2.5\/3D design in episode EP179 of the Semiconductor Insiders podcast. In this informative podcast, the panel digs into the move to chiplets. Why it\u2019s happening now and who can benefit from the trend are discussed in detail, along with considerations for ecosystem management. design methodology, the role of standards, and addressing the risks associated with this new design style. <\/p>\n\n\n\n<p><strong>In this podcast the panel discusses:<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Why chiplets are needed, and who needs them.<\/li>\n\n\n\n<li>How people design 2.5D today.<\/li>\n\n\n\n<li>The risks involved with 2.5D and 3D IC design.<\/li>\n\n\n\n<li>Provides insights into the future of chiplets.<\/li>\n<\/ul>\n\n\n\n<p><strong>This podcast episode is available to stream or download on SemiWiki\u2019s site <a href=\"https:\/\/semiwiki.com\/podcast\/333940\/\" target=\"_blank\" rel=\"noopener\">Click Here<\/a> as well as other popular podcast platforms.<\/strong> To learn more about Siemens 3D IC visit our <a href=\"https:\/\/eda.sw.siemens.com\/en-US\/ic-packaging\/3d-ic-design\/\" target=\"_blank\" rel=\"noopener\">3D IC design solutions website<\/a>.<\/p>\n\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<p>Also visit the Siemens <a href=\"https:\/\/blogs.sw.siemens.com\/podcasts\/category\/3d-ic\/\">3D IC podcast<\/a> to listen in as industry experts discuss 3D IC concepts and the latest trends: chiplet designs, IC packaging, multi-die verification, golden netlists, electrical signoff, system analysis, and more!<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-large is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-1024x1024.jpg\" alt=\"\" class=\"wp-image-285\" width=\"311\" height=\"311\" srcset=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-1024x1024.jpg 1024w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-600x600.jpg 600w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-150x150.jpg 150w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-768x768.jpg 768w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover-900x900.jpg 900w, https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/3D-IC-Podcast-Cover.jpg 1400w\" sizes=\"auto, (max-width: 311px) 100vw, 311px\" \/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<h3 class=\"wp-block-heading\">Listen to the 3D IC Podcast today!<\/h3>\n\n\n\n<p class=\"has-medium-font-size\">Available on:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><a href=\"https:\/\/open.spotify.com\/show\/1Y2MxqzeYfb9yRoTUx4iGQ\" target=\"_blank\" rel=\"noreferrer noopener\">Spotify<\/a><\/li>\n\n\n\n<li><a target=\"_blank\" href=\"https:\/\/music.amazon.com\/podcasts\/5e846524-0c7a-4af6-9f67-78f2c3f6156c\/3d-ic?ref=dm_sh_wFDJUzba14OudePJpmKt3tA5x\" rel=\"noreferrer noopener\">Amazon<\/a><\/li>\n\n\n\n<li><a target=\"_blank\" href=\"https:\/\/www.stitcher.com\/podcast\/siemens\/3d-ic\" rel=\"noreferrer noopener\">Stitcher<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/feeds.megaphone.fm\/TLFIE9746062536\" target=\"_blank\" rel=\"noreferrer noopener\">RSS<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/podcasts.apple.com\/us\/podcast\/3d-ic\/id1612354543\" target=\"_blank\" rel=\"noopener\">Apple Podcasts<\/a><\/li>\n<\/ul>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Listen in as Tony Mastroianni Advanced Packaging Solutions Director &#8211; Siemens EDA along with Saif Alam Vice President of Engineering&#8230;<\/p>\n","protected":false},"author":71824,"featured_media":287,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[1],"tags":[473],"industry":[],"product":[],"coauthors":[509],"class_list":["post-284","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-3d-ic"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/64\/2023\/09\/SemiWiki-logo-color-395x222-1.png","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/284","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/users\/71824"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/comments?post=284"}],"version-history":[{"count":5,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/284\/revisions"}],"predecessor-version":[{"id":298,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/posts\/284\/revisions\/298"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media\/287"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/media?parent=284"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/categories?post=284"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/tags?post=284"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/industry?post=284"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/product?post=284"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/semiconductor-packaging\/wp-json\/wp\/v2\/coauthors?post=284"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}