If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key. It is highly likely that you are planning to use the Universal Chiplet Interconnect Express (UCIe\u2122) technology as your chiplet-to-chiplet communication protocol. <\/p>\n\n\n\n
Chiplet-based designs using UCIe technology face a critical hurdle: ensuring protocol compliance and design feasibility for high-speed interconnections before committing to costly physical implementation. Without early verification, the risk of late-stage design failures increases significantly. <\/p>\n\n\n\n
To get the most performance and data throughput while using the least energy requires careful design planning. Before starting physical design, it\u2019s important to look at the impact of: <\/p>\n\n\n\n
By using standards-based analysis and vendor model-based IBIS-AMI simulation, designers can converge on the optimal design space. The goal is to balance protocol settings and channel optimization to deliver specific targets for bandwidth, throughput, speed, and power consumption. <\/p>\n\n\n\n
To help designers achieve these goals in the most predictable manner, Siemens has created the Innovator3D IC\u2122 Protocol Analyzer<\/strong>. This solution combines all essential tools into a single, unified technology: <\/p>\n\n\n\n This integrated approach gives designers confidence in design feasibility and accelerates the path to UCIe compliance, reducing both development risk and time-to-market. <\/p>\n\n\n\n\n
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