If you have not heard of it before, 3Dblox is an emerging standard that was first created by TSMC but is now managed by IEEE who are in the process of turning it into open standard. It already has broad EDA, foundry and OSAT support and is being leveraged today across the ecosystem. <\/p>\n\n\n\n
What is its goal? <\/p>\n\n\n\n
As an open ecosystem cross collaboration format that will enable transparent collaboration between EDA tools.<\/p>\n\n\n\n
3Dblox, a hardware description language, serves the procompetitive purpose of modularizing and streamlining the 3D\u00a0IC package solutions available in the semiconductor industry, helping to enhance interoperability and unleash innovation for 3D\u00a0IC designs. 3Dblox is also aimed at improving the current error-prone 3D\u00a0IC design process, and saving time and cost by enabling different EDA tools to speak the same language and support\u00a0chiplet\u00a0design reuse features<\/em>.<\/p>\n\n\n\n Siemens EDA is an early adopter of 3Dblox and our Innovator3D IC Integrator technology, which is a 2.5\/3D IC prototyping and pathfinding solution, can read, author, edit and write 3Dblox format across all three design abstraction levels. <\/p>\n\n\n\n You can find\u00a0out\u00a0more on Innovator3D IC Integrator here:\u00a0Innovator3D IC solution suite | Siemens Software<\/a>\u00a0<\/p>\n\n\n\n What are 3Dblox abstraction levels? The abstraction level is how devices, such as ASICs or Chiplets are described\/defined. <\/p>\n\n\n\n An example of early 3Dblox usage is described here: Siemens & ASE collaborate on 3Dblox workflows | Siemens<\/a> <\/p>\n\n\n\n\n
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