{"id":9367,"date":"2023-08-29T10:22:30","date_gmt":"2023-08-29T14:22:30","guid":{"rendered":"https:\/\/blogs.sw.siemens.com\/podcasts\/?p=9367"},"modified":"2026-03-26T15:10:39","modified_gmt":"2026-03-26T19:10:39","slug":"optimizing-multi-board-design","status":"publish","type":"post","link":"https:\/\/blogs.sw.siemens.com\/podcasts\/printed-circuit\/optimizing-multi-board-design\/","title":{"rendered":"Optimizing multi-board design"},"content":{"rendered":"<div class=\"embed-megaphone\">\n<iframe frameBorder=\"0\" height=\"482\" scrolling=\"no\" src=\"https:\/\/playlist.megaphone.fm\/?e=TLFIE8773145489\"\nwidth=\"100%\"><\/iframe>\n<\/div><!-- Megaphone -->\n\n\n<p>As the benefits of a model-based systems approach become evident through improved design quality, reduced errors, and enhanced collaboration, there are also challenges and roadblocks that need to be considered.<\/p>\n\n\n\n<p>I\u2019m your host, Steph Chavez. And here to join me is Chris Young, owner and lead engineer at Young Engineering Services. Today we will discuss the challenges and best practices associated with designing complex systems comprised of multiple interconnected printed circuit boards (PCBs)<\/p>\n\n\n\n<p>In this episode, you will learn about the various aspects of multi-board design, including the importance of an integrated systems approach, challenges in communication among different design teams, potential errors and problems arising from individual design silos, and the impact of signal integrity and compatibility issues.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">What you\u2019ll learn in this episode:<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>The benefits of building a robust toolchain (5:12)<\/li>\n\n\n\n<li>The keys to successful concurrent design (11:23)<\/li>\n\n\n\n<li>Two major roadblocks to implementing best practices: cultural resistance and learned helplessness (13:07)<\/li>\n\n\n\n<li>Ways to overcome these roadblocks (22:04)<\/li>\n\n\n\n<li>The importance of testing artifacts (23:49)<\/li>\n\n\n\n<li>Best practices when it comes to multi-board design and ways to make the design process more efficient (26:30)<\/li>\n<\/ul>\n\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2023\/03\/Chris_173.jpg\" alt=\"Chris Young\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Chris Young<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>President and Senior Staff Engineer, Young Engineering Services<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/christopher-young-69b66320\/\" target=\"_blank\" rel=\"noopener\">Connect with Chris on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n<div class=\"bio-block row\">\n    <div class=\"col-3 order-first bio-pic\">\n        <img decoding=\"async\" src=\"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2022\/11\/steph_chavez300-small.jpg\" alt=\"Steph Chavez\" \/>\n    <\/div>\n    <div class=\"col-9 bio-info\">\n        <div class=\"bio-header\">\n            <h4 class=\"speakerintro\">Steph Chavez<\/h4>\n        <\/div>\n        <div class=\"bio-biography\">\n            <p>Senior Product Marketing Manager<\/p>        <\/div>\n        <div class=\"bio-contact\">\n            <p><a href=\"https:\/\/www.linkedin.com\/in\/stephen-v-chavez-59985012\/\" target=\"_blank\" rel=\"noopener\">Connect with Steph on LinkedIn <\/a><\/p>\n        <\/div>\n    <\/div>\n<\/div>\n\n\n<hr class=\"wp-block-separator has-alpha-channel-opacity\"\/>\n\n\n\n<h2 class=\"wp-block-heading\">Want more PCB design best practices?<\/h2>\n\n\n\n<p>Learn PCB design best practices from an industry expert with over 30 years of experience, broken down into five pillars:<\/p>\n\n\n\n<ol class=\"wp-block-list\" type=\"1\" start=\"1\">\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/digitally-integrated-and-optimized\/library-design-data-management\/?ref=EBS_blog\" target=\"_blank\" rel=\"noreferrer noopener\">Digitally integrated and optimized<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/engineering-productivity-and-efficiency\/advanced-design\/?ref=EBS_blog\" target=\"_blank\" rel=\"noreferrer noopener\">Engineering productivity and efficiency<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/digital-prototype-driven-verification\/?ref=EBS_blog\" target=\"_blank\" rel=\"noreferrer noopener\">Digital prototype-driven verification<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/model-based-systems-engineering\/?ref=EBS_blog\" target=\"_blank\" rel=\"noreferrer noopener\">System-level model-based engineering<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/eda.sw.siemens.com\/en-US\/pcb\/supply-chain-resilience\/?ref=EBS_blog\" target=\"_blank\" rel=\"noreferrer noopener\">Supply chain resilience<\/a><\/li>\n<\/ol>\n\n\n\n<p>Take your PCB design process to the next level today by checking out this content!<\/p>\n","protected":false},"excerpt":{"rendered":"<p>As the benefits of a model-based systems approach become evident through improved design quality, reduced errors, and enhanced collaboration, there&#8230;<\/p>\n","protected":false},"author":86290,"featured_media":9369,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"spanish_translation":"","french_translation":"","german_translation":"","italian_translation":"","polish_translation":"","japanese_translation":"","chinese_translation":"","footnotes":""},"categories":[751],"tags":[325,899,756,765],"industry":[],"product":[283],"coauthors":[753],"class_list":["post-9367","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-printed-circuit","tag-mbse","tag-multi-board-design","tag-pcb-design","tag-pcb-design-best-practices","product-xpedition-enterprise"],"featured_image_url":"https:\/\/blogs.sw.siemens.com\/wp-content\/uploads\/sites\/32\/2023\/08\/PCB_Design_Best_Practices_Multi-board_design_720x404.jpg","_links":{"self":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/9367","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/users\/86290"}],"replies":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/comments?post=9367"}],"version-history":[{"count":2,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/9367\/revisions"}],"predecessor-version":[{"id":9370,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/posts\/9367\/revisions\/9370"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media\/9369"}],"wp:attachment":[{"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/media?parent=9367"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/categories?post=9367"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/tags?post=9367"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/industry?post=9367"},{"taxonomy":"product","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/product?post=9367"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/blogs.sw.siemens.com\/podcasts\/wp-json\/wp\/v2\/coauthors?post=9367"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}